Patents Assigned to EARTHONE CIRCUIT TECHNOLOGIES CORPORATION
  • Method of forming a conductive image on a non-conductive surface
    Patent number: 8784952
    Abstract: The present invention relates to a method for forming a raised conductive image on a non-conductive or dielectric surface, the method comprising placing a metal coordination complex on a surface of the substrate, exposing the surface to electromagnetic radiation, reducing the exposed complex. removing unexposed complex leaving an elemental metal image, removing unexposed metal complex and then plating the resulting elemental metal image with a highly conductive material.
    Type: Grant
    Filed: February 23, 2012
    Date of Patent: July 22, 2014
    Assignee: Earthone Circuit Technologies Corporation
    Inventor: William Wismann
  • Method of forming a conductive image on a non-conductive surface
    Patent number: 8784953
    Abstract: The present invention relates to a method for forming a raised conductive image on a non-conductive or dielectric surface, the method comprising placing a metal coordination complex on a surface of the substrate, exposing the surface to electromagnetic radiation, reducing the exposed complex. removing unexposed complex leaving an elemental metal image, removing unexposed metal complex and then plating the resulting elemental metal image with a highly conductive material.
    Type: Grant
    Filed: August 16, 2012
    Date of Patent: July 22, 2014
    Assignee: Earthone Circuit Technologies Corporation
    Inventor: William Wismann
  • METHOD OF FORMING A CONDUCTIVE IMAGE ON A NON-CONDUCTIVE SURFACE
    Publication number: 20130043062
    Abstract: The present invention relates to a method for forming a raised conductive image on a non-conductive or dielectric surface, the method comprising placing a metal coordination complex on a surface of the substrate, exposing the surface to electromagnetic radiation, reducing the exposed complex. removing unexposed complex leaving an elemental metal image, removing unexposed metal complex and then plating the resulting elemental metal image with a highly conductive material.
    Type: Application
    Filed: August 16, 2012
    Publication date: February 21, 2013
    Applicant: EARTHONE CIRCUIT TECHNOLOGIES CORPORATION
    Inventor: William Wismann