Patents Assigned to Ebara Corporation
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Patent number: 6116169Abstract: In an improved system for recovering heat from a combustion gas produced by burning wastes, the combustion gas or combustible gas produced by partial burning of the wastes subjected to dust filtration in a temperature range of 450-650.degree. C. at a filtration velocity of 1-5 cm/sec under a pressure of from -5 kPa (gage) to 5 MPa before heat recovery is effected. The dust filtration is preferably performed using a filter medium which may or may not support a denitration catalyst. Heat recovery is preferably effected using a steam superheater. The dust-free gas may partly or wholly be reburnt with or without an auxiliary fuel to a sufficiently high temperature to permit heat recovery. The combustion furnace may be a gasifying furnace which, in turn, may be combined with a melting furnace.Type: GrantFiled: December 16, 1998Date of Patent: September 12, 2000Assignee: Ebara CorporationInventors: Norihisa Miyoshi, Shosaku Fujinami, Tetsuhisa Hirose, Masaaki Irie, Kazuo Takano, Takahiro Oshita
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Patent number: 6116986Abstract: A polishing plant includes a polishing apparatus having a top ring for holding a workpiece and a turn table for polishing a surface of the workpiece held by the top ring. A cleaning apparatus has cleaning machines for cleaning the workpiece polished by the polishing apparatus. At least one drainage pipe connected to the polishing apparatus discharges a waste liquid from the polishing apparatus, and at least one drainage pipe connected to the cleaning apparatus to discharges a waste liquid from the cleaning apparatus are provided as separate plural of drainage pipe lines, depending on the type of waste liquid. By use of the polishing plant of the present invention, treatment waste liquids can be efficiently conducted.Type: GrantFiled: November 13, 1997Date of Patent: September 12, 2000Assignee: Ebara CorporationInventors: Tetsuji Togawa, Kuniaki Yamaguchi
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Patent number: 6116994Abstract: A compact polishing apparatus has been developed which can be installed in a relatively small space, and is highly rigid without increasing the weight of the apparatus. The polishing apparatus comprises a polishing table, a top ring head for rotatably holding a substrate, a substrate transfer device for transferring the substrate to and from a substrate storage section, a substrate delivery device for delivery of the substrate between the top ring head and the substrate transfer device at a delivery position outside of the polishing table. A guide rail device is laid between the polishing table and the substrate delivery device, and a carriage device movable along the guide rail device is provided for carrying the top ring device thereon.Type: GrantFiled: April 10, 1998Date of Patent: September 12, 2000Assignee: Ebara CorporationInventors: Kenya Ito, Hideo Aizawa
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Patent number: 6116047Abstract: A double effect absorption cold or hot water generating machine can supply hot water from a water heater even when it is used for a cooling operation. The double effect absorption cold or hot water generating machine comprises an absorber, an evaporator, a high temperature generator, a low temperature generator, a condenser, a high temperature heat exchanger, a low temperature heat exchanger, and a water heater.Type: GrantFiled: October 1, 1998Date of Patent: September 12, 2000Assignee: Ebara CorporationInventors: Naoyuki Inoue, Takashi Yasuda, Shouji Tanaka, Makoto Agatsuma, Teruo Shiraishi
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Patent number: 6117686Abstract: The present invention provides a method by which harmful trace gases in a gaseous mixture containing as such harmful halogen gases, halogenated hydrogen gases, acid gases, oxidizing gases, basic gases, organic acid gases, especially halogen gases or halogenated hydrogen gases, are detected by using tetraphenylporphyrin (TPP) and quantitated from a calibration curve constructed therefrom, where the range of detectable concentration is made adjustable so that harmful gas can be detected and quantitated over a broad range of concentration. Furthermore, this invention also provides a method for extending the accessible range of gas concentration by adjusting the sensitivity of the detector material via control of tetraphenylporphyrin concentration in matrix polymer of the detector material, by controlling the gas concentration range via measurement at a specific wavelength(s), and by the use of a plurality of detector materials with pre-set assay sensitivity.Type: GrantFiled: August 3, 1999Date of Patent: September 12, 2000Assignee: Ebara CorporationInventors: Kazunari Tanaka, Chiaki Igarashi, Yoshihiko Sadaoka
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Patent number: 6110352Abstract: Wastewater containing a surfactant and an oil content that has been emulsified by the action of the surfactant can be freed of the oil content by a method including feeding the wastewater into the anode compartment, for electrolysis, of a diaphragm electrolyzer having an anode and a cathode provided in the anode compartment and a cathode compartment, respectively, which are spaced apart by a porous diaphragm and which are supplied with a dc voltage between the anode and the cathode, passing part of the electrolyzed wastewater through the diaphragm so that it enters the cathode compartment, discharging the influent from the cathode compartment, discharging the remainder of the electrolyzed wastewater from the anode compartment and introducing the same into the intermediate portion of a gas-liquid separator, withdrawing part of the influent from the top of the gas-liquid separator and introducing the same into a layer packed with an adhering material, where it is brought into contact with the adhering material,Type: GrantFiled: November 18, 1998Date of Patent: August 29, 2000Assignee: Ebara CorporationInventors: Qingquan Su, Hiroaki Sato, Michihiro Noda
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Patent number: 6110024Abstract: A polishing apparatus for polishing a workpiece such as a semiconductor wafer includes a polishing section for polishing a surface of the workpiece held by the top ring, and a cleaning section for cleaning the workpiece which has been polished in the polishing section. The polishing apparatus further includes a workpiece transfer robot for transferring the workpiece to be polished to the polishing section or the workpiece which has been polished in the cleaning section. The workpiece transfer robot has a robot body, at least one arm operatively coupled to the robot body by at least one joint, a holder mechanism mounted on the: arm for holding a workpiece, and a sealing mechanism provided at the joint for preventing liquid from entering an interior of the joint.Type: GrantFiled: September 4, 1997Date of Patent: August 29, 2000Assignee: Ebara CorporationInventor: Tetsuji Togawa
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Patent number: 6109108Abstract: An electromagnetic acoustic transducer is provided which includes magnets and a sheet type coil unit. The magnets are permanent magnets or electromagnets to provide a static magnetic field to an object to be inspected. The coil unit includes a pair of spiral or meander coils of an electrically conductive material, sandwiched between upper and middle insulation sheet and middle and lower insulation sheet. The coils are used for transmission and reception, respectively. All the ends of the respective coils extend through throughholes formed through the upper and middle insulation sheets to the surface of the ultrasonic transducer, and are connected to external leads. The ends for earth are commonly connected to form a common ground terminal. The inspection system with the electromagnetic acoustic resonance which is a combination of resonant technique and a non-contact electromagnetic acoustic transducer can accomplish evaluating the absolute value of ultrasonic attenuation.Type: GrantFiled: September 29, 1997Date of Patent: August 29, 2000Assignee: Ebara CorporationInventors: Toshihiro Ohtani, Hirotsugu Ogi, Masahiko Hirao
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Patent number: 6111680Abstract: A transmitter is provided for transmitting an analog signal. The transmitter has an input receiving the analog signal within a range of values. The transmitter also includes a duty cycle modulator generating a modulated two state signal having a maximum frequency at an intermediate value of the range. The duty cycle of the modulated signal is monotonically related to the analog signal while the frequency of the signal decreases with increase and decrease of the value of the analog signal from the intermediate value. The transmitter further includes an output for transmitting the modulated signal on a communication channel. A receiver is also provided that includes an input receiving the modulated two state signal from the transmitter, and a circuit for translating the received signals to an output analog signal.Type: GrantFiled: December 1, 1997Date of Patent: August 29, 2000Assignee: Ebara CorporationInventor: Philip C. Harvey
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Patent number: 6106635Abstract: A washing method provides a liquid jet washing by jetting a liquid against a rotating thin-plate-shaped workpiece from a nozzle which shifts while being positioned opposite a front or back surface of the workpiece, thus removing dust adhering to the front or back surface and thereby washing the workpiece. The locus of the shifting nozzle is caused to pass in the vicinity of, but not over, the center of rotation of the workpiece. Electronic circuitry present at the central portion of workpiece is prevented from suffering electrostatic breakage caused by collision with washing liquid. At the same time, an appropriate quantity of washing liquid is made to collide with the entire surface of a workpiece, so that the workpiece can be washed satisfactorily.Type: GrantFiled: March 6, 1998Date of Patent: August 22, 2000Assignee: Ebara CorporationInventors: Satomi Hamada, Toshiro Maekawa
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Patent number: 6102786Abstract: A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projecting region is determined on the basis of an area in which the projecting region acts on the workpiece.Type: GrantFiled: January 21, 1999Date of Patent: August 15, 2000Assignee: Ebara CorporationInventors: Masayoshi Hirose, Yoshimi Sasaki, Akira Ogata, Seiji Ishikawa, Tamami Takahashi, Hirokuni Hiyama, Yutaka Wada
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Patent number: 6099698Abstract: It is an object of the present invention to provide a method of making a magnetic disk having a uniform textured structure with micro-waviness of fabrication depth of less than 20 nm, preferably less than 10 nm, and a local depth deviation of less than 5%, in which texture patterns are characterized by the fact that lateral surfaces of the structure are sloped or curved. The object has been achieved in a method for making a magnetic disk having micro-waviness on a fabrication surface of a substrate for reducing dynamic friction and controlling head float, by rotating and irradiating the fabrication surface with a high energy beam from a beam source at an inclined angle to the substrate surface, through a shielding mask having a specific pattern, so as to process a transcription pattern on the substrate surface to produce a textured structure with micro-waviness having sloped or curved side surfaces.Type: GrantFiled: October 2, 1998Date of Patent: August 8, 2000Assignee: Ebara CorporationInventors: Masahiro Hatakeyama, Katsunori Ichiki, Kenji Watanabe, Kazuo Yamauchi, Shinta Kunitomo, Tohru Satake, Yasushi Tohma, Juichi Ishiguro
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Patent number: 6096557Abstract: This invention provides a method for determining the concentration of a gas to be detected by a gas detector using a gas reactive pigment, wherein the dynamic range of the detectable concentration can be controlled. The method comprising bringing a gas to be detected such as a halogen gas, a hydrogen halide gas or the like into contact with a gas detector placed in a detection area and comprising a gas reactive pigment tetraphenylporphyrin or a derivative thereof represented by the general formula (1) or a metal complex of tetraphenylporphyrin or a derivative thereof represented by the general formula (2); and irradiating said gas detector with a detection beam and measuring a color change in said gas detector to determine the concentration of said gas to be detected, wherein the measurement is carried out in the temperature range from 40 to 80.degree. C. of said detection area; and a detection apparatus for carrying out the said method are disclosed.Type: GrantFiled: August 13, 1997Date of Patent: August 1, 2000Assignee: Ebara CorporationInventors: Kazunari Tanaka, Chiaki Igarashi, Yoshihiko Sadaoka
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Patent number: 6093288Abstract: A high temperature gas containing sulfur oxides is desulfurized by converting sulfur oxides to ammonium compounds by the injection of ammonia and irradiation with an electron beam. The high temperature gas containing the sulfur oxides is cooled by contacting the gas with recirculated cooling water, then mixed with ammonia, air, and water and irradiated with an electron beam.Type: GrantFiled: August 27, 1998Date of Patent: July 25, 2000Assignee: Ebara CorporationInventors: Masahiro Izutsu, Yoshitaka Iizuka
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Patent number: 6093307Abstract: Wastewater containing a surfactant and an oil content that has been emulsified by the action of the surfactant can be freed of the oil content by a method to including feeding the wastewater into the anode compartment, for electrolysis, of a diaphragm electrolyzer having an anode and a cathode provided in the anode compartment and a cathode compartment, respectively, which are spaced apart by a porous diaphragm and which are supplied with a dc voltage between said anode and cathode, passing part of the electrolyzed wastewater through the diaphragm so that it enters the cathode compartment, discharging the influent from the cathode compartment, discharging the remainder of said electrolyzed wastewater from the anode compartment and introducing the same into the intermediate portion of a gas-liquid separator, withdrawing part of the influent from the top of the gas-liquid separator and introducing the same into a layer packed with an adhering material, where it is brought into contact with the adhering materialType: GrantFiled: November 18, 1998Date of Patent: July 25, 2000Assignee: Ebara CorporationInventors: Qingquan Su, Hiroaki Sato, Michihiro Noda
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Patent number: 6092542Abstract: A cleaning apparatus is used for cleaning a substrate such as a semiconductor wafer, a glass substrate, or a liquid crystal panel with a cleaning member. The cleaning apparatus includes: a holding mechanism for holding a workpiece, an arm movable relative to the workpiece, a cleaning member mounted on the arm for cleaning the workpiece held by the holding mechanism, a moving mechanism for vertically moving the cleaning member with respect to the workpiece held by the holding mechanism, and a controller for controlling the moving mechanism to adjust the cleaning member to a setting height.Type: GrantFiled: March 26, 1999Date of Patent: July 25, 2000Assignee: Ebara CorporationInventors: Naoki Matsuda, Yoshiyuki Ohta, Kenya Ito, Takahiro Nanjo
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Patent number: 6092994Abstract: A screw pump includes a casing having inlet and outlet ports and a pump rotor rotatably mounted in the casing and having screw threads communicating with said inlet and outlet ports. The pump rotor is rotated by a reversible speed-controllable motor, typically a DC brushless motor, mounted in the casing to deliver a liquid such as a chemical solution from the inlet port through a liquid passage defined by the screw threads to the outlet port.Type: GrantFiled: January 28, 1998Date of Patent: July 25, 2000Assignees: Ebara Corporation, Ebara Densan Ltd.Inventors: Shigekazu Yamamoto, Tetsuma Ikegami, Hiroshi Sobukawa, Shun-ichi Aiyoshizawa, Toshiharu Nakazawa, Yoshinori Ojima
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Patent number: 6088508Abstract: A vacuum pump for use in an evacuating system for a semiconductor fabrication apparatus is operated at a steady rotational speed to evacuate the semiconductor fabrication apparatus. Then, in response to a signal indicative of an operating state of the semiconductor fabrication apparatus which does not need to be evacuated, the rotational speed of the vacuum pump is reduced to an idling rotational speed, thereby to lower electric energy consumption by the vacuum pump.Type: GrantFiled: August 28, 1998Date of Patent: July 11, 2000Assignee: Ebara CorporationInventors: Yoshimitsu Ishibashi, Katsuaki Usui
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Patent number: 6082964Abstract: A pump has an impeller, a casing defining a pump chamber around the impeller for receiving a fluid discharged from the impeller; and, a seal mechanism provided between the impeller and the casing to prevent a fluid from leaking from the pump chamber through an annular space formed between the casing and the impeller. The seal mechanism comprises an annular seal member for blocking the annular space leaving an annular gap between the impeller and the seal member. The annular seal member is movably supported so that the annular seal member is supported in a floating condition in the fluid therearound in operation.Type: GrantFiled: September 29, 1998Date of Patent: July 4, 2000Assignee: Ebara CorporationInventor: So Kuroiwa
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Patent number: 6079073Abstract: A roll type washer is a primary washer and includes a roll type washing member which rotates in contact with the surface of a semiconductor wafer, and a rotary driving member which rotates the semiconductor wafer. A secondary washer is a pad type washer including a pad washing mechanism which rotates and pivots over the semiconductor surface while in contact with the surface, and a rotary member which rotates the semiconductor wafer.Type: GrantFiled: April 1, 1998Date of Patent: June 27, 2000Assignee: Ebara CorporationInventor: Toshiro Maekawa