Patents Assigned to Ebara Technologies
  • Method and polishing pad design enabling improved wafer removal from a polishing pad in a CMP process
    Publication number: 20040108063
    Abstract: The invention provides a chemical mechanical polishing pad and method that enables improved wafer removal from the polishing pad after completion of chemical mechanical polishing of the wafer.
    Type: Application
    Filed: March 7, 2003
    Publication date: June 10, 2004
    Applicant: Ebara Technologies
    Inventors: Alejandro Reyes, Gerard Moloney, Cormac Walsh, Ernesto Saldana