Abstract: The invention provides a chemical mechanical polishing and pad dressing method based on differing the rotational of a pad dresser, head, and/or polishing pad to improve center removal slow profiling.

Abstract: A chemical mechanical processing apparatus includes a polishing pad capable of polishing a substrate; a stepped retaining having an inner side, a bottom side, and an open region, the open region extending radially outward from the inner side and upward from the bottom side, the open region providing space for pad rebound, the open region further having a plurality of tips to hold a substrate in position during rotation of the substrate against the polishing pad, the stepped retaining ring capable of rotating the substrate against the polishing pad; and a dispenser capable of dispensing a slurry onto the pad.

Abstract: The system includes a polishing pad, a pad height sensor; a window; and a window raising mechanism. The polishing pad has an aperture with the window vertically moveable therein. The pad height sensor is positioned above the polishing pad and measures the vertical position of the pad before polishing. The window raising mechanism adjusts the vertical position of the window based on information from the pad height sensor. An endpoint measurement sensor can be disposed beneath the window for in-situ measurement of the polishing process.

Abstract: A chemical mechanical processing apparatus includes a polishing pad capable to polish a substrate; a stepped retaining having an inner side, a bottom side, and an open region, the open region extending radially outward from the inner side and upward from the bottom side, the open region providing space for pad rebound, the open region further having a plurality of tips to hold a substrate in position during rotation of the substrate against the polishing pad, the stepped retaining ring capable to rotate the substrate against the polishing pad; and a dispenser capable to dispense a slurry onto the pad.

Abstract: Apparatus for vacuum pumping an enclosed chamber without the use of activated charcoal to remove hydrogen by cryosorption. As a result, the potential for contamination by a sorbent material is eliminated. The pumping structure includes an integral two-stage vacuum pump. The first-stage pump is a cryogenic pump having a pump chamber and cryoarrays mounted on an expander for cryocondensation of the principal gases present in the vacuum chamber. The second-stage pump operates at room temperatures and includes one or more getter pumps whose principal function is to remove hydrogen molecules that may be present in the vacuum chamber after the first-stage cryopump has removed most of the cryocondensable gases from the vacuum chamber. In one aspect of the invention, the first-stage pump is separated from the second-stage pump by a gate valve to protect the getter pumps during the regeneration flushing of nitrogen through the first-stage cryogenic pump chamber.