Abstract: The invention provides a vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof.

Abstract: The invention provides a pad removal apparatus and method that enables improved pad removal from a platen.

Abstract: The invention provides a pad removal apparatus and method that enables improved pad removal from a platen.

Abstract: The system includes a polishing pad, a pad height sensor; a window; and a window raising mechanism. The polishing pad has an aperture with the window vertically moveable therein. The pad height sensor is positioned above the polishing pad and measures the vertical position of the pad before polishing. The window raising mechanism adjusts the vertical position of the window based on information from the pad height sensor. An endpoint measurement sensor can be disposed beneath the window for in-situ measurement of the polishing process.

Abstract: The invention provides a vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof.

Abstract: The invention provides a chemical mechanical polishing and pad dressing method based on differing the rotational of a pad dresser, head, and/or polishing pad to improve center removal slow profiling.

Abstract: Methods and apparatus for partial regeneration of a cryopump are provided. The cyropump includes first and second stage cryoarrays, a refrigerator for cooling the first and second stage cryoarrays, and typically includes a sorbent material for removing gases by cryosorption. The second stage cryoarray is heated from its operating temperature to a partial regeneration temperature range selected to liberate captured gas from the second stage cryoarray and to retain condensed water vapor on the first stage cryoarray. The partial regeneration temperature range is preferably 100K to 160K and is more preferably 120K to 140K. When the second stage cryoarray has a temperature within the partial regeneration temperature range, gas liberated from the second stage cryoarray is pumped with a turbomolecular pump in fluid communication with the cryopump. The turbomolecular pump removes liberated gases from the cryopump at high speeds and produces a low pressure in the cryopump.

Abstract: Apparatus and method for vacuum pumping an enclosed chamber includes a cryogenic pumping device in fluid communication with the chamber for removing gases from the chamber. The cryogenic pumping device includes a cooled pumping surface and an expander for expanding a compressed gas and thereby cooling the pumping surface. The vacuum pumping apparatus further includes a sensor for sensing an operating parameter, such as temperature, of the cryogenic pumping device and a controller responsive to the sensor for controlling the operating speed of the expander to produce a desired value of the operating parameter. Typically, the sensor is a temperature sensor, and the controller controls the speed of the expander motor.

Abstract: Cryopump apparatus and method for controlling the operating temperature of a cryoarray in a cryopump. The cryopump has means for thermally isolating one of more of the cryoarrays from the refrigeration source. The means for thermally isolating is a thermal switch formed from at least first and second switch elements made of materials having dissimilar coefficients of thermal expansion. The thermal switch is also used in isolating one of the pump's cryoarrays during a partial regeneration process. The thermal switch of the preferred embodiment may also be used to prevent one of the pump's cryoarrays from falling below a predetermined operating temperature.

Abstract: Apparatus for vacuum pumping an enclosed chamber includes a cryopump in gas communication with the chamber for removing gases by cryocondensation and cryotrapping and an auxiliary pumping device for removing gases that are difficult to remove by cryocondensation or cryotrapping. The cryopump does not contain a sorbent material for cryosorption. As a result, the potential for contamination by a sorbent material is eliminated. The auxiliary pumping device can comprise an ion pump or a turbomolecular vacuum pump. When an ion pump is used, the ion pump is inactivated during periods of high gas loading in the chamber. The vacuum pumping apparatus is particularly useful for vacuum pumping of a plasma vapor deposition chamber.