Abstract: An object is to provide a laminated polyimide substrate, and a method for the production thereof, in which various properties are ensured and/or provided by effectively controlling changes over time under stringent conditions, while ensuring sufficient adhesion between a polyimide film and metal layer. A laminated polyimide substrate comprises a polyimide layer, an alkali-treated layer derived from the polyimide layer, and a metal layer, arranged in that order, wherein the alkali-treated layer contains an anionic functional group, and is a laminated structure having a layer containing a metal catalyst arranged on the metal layer side and a layer containing a complex of the metal catalyst arranged on the polyimide layer side.

Abstract: There are provided technologies for adsorbing a catalyst metal selectively to an anionic group such as a carboxyl group, thereby forming a metal film on a nonconductive resin selectively, including a palladium complex represented by the following formula (I): wherein L represents an alkylene group and R represents an amino group or a guanidyl group, or a structural isomer thereof, a processing solution for electroless plating catalyst application containing the complex as an active component, and a method for forming a metal plated film on a nonconductive resin, containing subjecting a nonconductive resin having a surface anionic group to a catalyst adsorbing treatment using the processing solution and then to a reduction treatment, electroless metal plating, and metal electroplating.

Abstract: For the purpose of providing a method capable of conveniently enhancing adhesion between a metal film and an insulating resin upon forming the metal film on a flat surface of the insulating resin, the invention provides a method for conditioning an insulating resin, comprising hydrophilizing an insulating resin, treating the insulating resin with a solution containing a polymer having a primary amine, a secondary amine or both of them on a side chain thereof, and a method for metallizing an insulating resin utilizing the conditioning method.

Abstract: There are provided technologies for adsorbing a catalyst metal selectively to an anionic group such as a carboxyl group, thereby forming a metal film on a nonconductive resin selectively, including a palladium complex represented by the following formula (I): wherein L represents an alkylene group and R represents an amino group or a guanidyl group, or a structural isomer thereof, a processing solution for electroless plating catalyst application containing the complex as an active component, and a method for forming a metal plated film on a nonconductive resin, containing subjecting a nonconductive resin having a surface anionic group to a catalyst adsorbing treatment using the processing solution and then to a reduction treatment, electroless metal plating, and metal electroplating.

Abstract: Disclosed is a technique for direct plating which causes no deposition of a metal on the rack coating. A catalyst attachment-enhancing agent comprising a high molecular compound having primary, secondary and tertiary amino groups as active ingredient; and a method for direct electroplating onto a Pd/Sn colloidal catalyst which has been subjected to a conductivity-imparting treatment, comprising the step of, prior to the attachment of the Pd/Sn colloidal catalyst to a non-conductive material, treating the non-conductive material with a catalyst attachment-enhancing agent which comprises a high molecular compound having primary, secondary and tertiary amino groups as an active ingredient.

Abstract: A surface modification liquid for plastic that in pretreatment for metallization of a plastic surface by metal plating, solves the problems of etching treatment with the use of conventional etching liquid containing chromic acid, etc. There is provided a surface modification liquid for plastic characterized by containing permanganic acid, phosphoric acid and nitric acid.

Abstract: An acid copper plating solution and plating method are disclosed. The acid copper plating solution comprises copper ions, an organic acid or an inorganic acid, chloride ions, high molecular weight surfactant which controls the electrodeposition reaction, and a sulfur-containing saturated organic compound which promotes the electrocoating rate, wherein the high molecular weight surfactant comprises two or more types with different hydrophobicities. The plating method is a method for forming a plating film on a conductor layer, which is formed on at least a part of a structural object having a concave-convex pattern on a semiconductor substrate, and comprises providing a cathode potential to the conductor layer and supplying a plating solution which electrically connects an anode with the conductor layer, wherein the plating solution contains 25-75 g/l of copper ion and 0.4 mol/l of an organic acid or inorganic acid and an electric resistor is installed between the conductor layer and the anode.

Abstract: An additive for copper plating comprising, as an effective ingredient, a nitrogen-containing biphenyl derivative represented by the following formula (I): [wherein X represents a group selected from the following groups (II)-(VII): and Y represents a lower alkyl group, lower alkoxy group, nitro group, amino group, sulfonyl group, cyano group, carbonyl group, 1-pyridyl group, or the formula (VIII): (wherein R? represents a lower alkyl group)], a copper plating solution formed by adding the additive for copper plating to a copper plating solution containing a copper ion ingredient and an anion ingredient, and a method of manufacturing on an electronic circuit substrate having a fine copper wiring circuit, which comprises electroplating in the copper plating solution using as the cathode an electronic circuit substrate in which fine microholes or microgrooves in the shape of an electronic circuit are formed on the surface.

Abstract: An acid copper plating solution comprises copper ions, an organic acid or an inorganic acid, chloride ions, a high molecular weight surfactant that controls the electrodeposition reaction, and a sulfur-containing saturated organic compound that promotes the electrocoating rate. The high molecular weight surfactant comprises two or more types of surfactants with different hydrophobicities. The plating solution is used for forming a plating film on a conductor layer.

Abstract: A copper plating bath comprising a reaction condensate of an amine compound and glycidyl ether and/or a quaternary ammonium derivative of this reaction condensate, and a plating method using this copper plating bath are disclosed. A copper plating bath capable of providing highly reliable copper plating on a substrate such as a silicone wafer semiconductor substrate or printed board having minute circuit patterns and small holes such as blind via-holes, through-holes, and the like, and a method of copper plating using the copper plating bath can be provided.

Abstract: A process of performing via-filling efficiently and by a simple procedure is disclosed. The via-filling process comprises providing a substrate having blind via-holes, making the substrate electrically conductive, and plating the substrate in an acid copper plating bath which comprises the following components (A) to (E): (A) copper sulfate at a concentration of 100-300 g/L, (B) copper sulfate at a concentration of 30-150 g/L, (C) a first component (polymer component) such as polyethylene glycol, polypropylene glycol, and Pluronic surfactants, at a concentration of 10-1000 mg/L, (D) a second component (carrier component) such as sodium sulfoalkyl sulfonates and bis-sulfo organic compounds at a concentration of 0.1-20 mg/L, and (E) a third component (leveler component) such as polyalkylene imines, 1-hydroxyethyl-2-alkyl imidazoline chlorides, auramine and its derivatives at a concentration of 0.05-10 mg/L.

Abstract: An acidic Sn—Cu alloy plating bath composition comprising: (a) Sn2+ ions and Cu2+ ions, (b) at least one acid selected from the group consisting of alkane sulfonic acids, alkanol sulfonic acids, and sulfuric acid, and (c) a thiourea compound. The composition exhibits high current efficiency and does not cause Cu to deposit on the Sn anode, the Sn—Cu alloy plating bath is free from such problems as inadequate adhesion of the plating to substrate and covering of with copper deposit. Moreover, processing waste water from the Sn—Cu plating bath is easy because the composition does not contain a complexing agent. The Sn—Cu alloy plating bath of the present invention, therefore, can advantageously produce not only Sn—Cu alloy plating but also ternary alloy plating containing other metals in an industrial scale.

Abstract: A printed circuit board comprising a metal copper film having 105 to 109 micropores per square centimeter wherein the metal copper film is prepared by dipping a plating object into an electroless copper plating solution comprising a copper ion, a complexing agent, a hypophosphorus acid compound, a metallic catalyst for initiating the reductive reaction, and a compound containing an acetylenic bond.

Abstract: An electroless copper plating solution which is based on an electroless copper plating solution comprising a copper ion, a complexing agent, a hypophosphorous acid compound as a reducing agent, and a metallic catalyst for initiating a reductive reaction, as characterized by further comprising a lithium ion or both a lithium ion and a polyoxyethylene type surfactant, and a method for electroless copper plating using the same, as well as a plated product made by such a process. The electroless copper plating solution in the present invention enables a uniform and acicular copper film to be deposited on the surface of a plating object, and therefore can be used for improving the strength of adhesion between various metals and resins, including bonding of a copper foil to a resin as applied in a conductive circuit such as a multi-layer printed circuit board or in a copper-plated laminate.

Abstract: An electroplating apparatus capable of forming a film of a uniform thickness on a substrate for printed wiring irrespective of a size of the substrate. Insoluble anode plates are arranged in a plurality of pairs in an electroplating tank in a manner to be juxtaposed to each other along a transfer passage along which the substrate is horizontally transferred and electrically independent from each other for every pair. The insoluble anode plates in each pair are arranged so as to be vertically spaced from each other with the transfer passage being interposed therebetween and are independently connected to an anode terminal of each of rectifiers. Cathode terminals of the rectifiers are electrically connected together to clips for holding the substrate. Electroplating on the substrate is carried out by feeding only the insoluble anode plates contained in a plane of projection of the substrate defined in a vertical direction of the substrate with electricity.

Abstract: An electroplating bath solution for zinc-cobalt-iron alloy and electroplated product electroplating by the bath solution are described.The electroplating bath solution containing 5-30 g/l Zn, 0.01-0.3 g/l Co and 0.02-0.5 g/l Fe, and electroplating layer of the product contains 0.1-0.6 wt % Co, 0.2-0.7 wt % Fe and Zn.The electroplated product gives a high quality black chromate film at cheaper cost than before.

Abstract: An aqueous acidic electrolyte of the chloride, sulfate and mixed chloride-sulfate types suitable for electrodepositing a zinc-nickel alloy on a conductive substrate comprising an aqueous solution containing zinc ions and nickel ions, and an additive agent of a class selected from the group consisting of (a) aromatic sulfonic acids, (b) aromatic sulfonamides, sulfonimides and mixed carboxamides/sulfonamides, (c) acetylene alcohols as well as the bath soluble and compatible salts and mixtures thereof. The invention further encompasses the process for electrodepositing a zinc-nickel alloy employing the aforementioned electrolyte.

Abstract: The present invention includes an aqueous acidic chromate solution, suitable for forming colored chromate coatings on zinc-nickel alloy electrodeposits containing up to about 15% by weight nickel, which solutions have a pH within the range of about 1.3 to about 2.7, a hexavalent chromium concentration of at least 0.5 grams per liter, and preferably about 0.5 to about 100 grams per liter, and which contain sulfate in a weight ratio of SO.sub.4 :Cr.sup.+6 of about 0.025-1.5:1.The zinc-nickel alloy electrodeposits are preferably immersed in the chromating solution for a period sufficient to form the desired colored chromate coating. In some instances, a flash electrodeposit of zinc may be applied to the zinc-nickel alloy electrodeposit before it is immersed in the chromating solution.

Abstract: A sludge containing a sparingly soluble metal compound such as nickel carbonate or the like is supplied to an anode compartment or an intermediate compartment of an electrolytic cell provided with an anode compartment and a cathode compartment or with an anode compartment, an intermediate compartment and a cathode compartment each sectioned by a filter membrane or an ion-exchange membrane, and thereafter an electrolytic treatment is conducted by using an insoluble electrode as anode and a usual electrode as cathode to precipitate a metal such as nickel on the cathode. Effective recovery of a metal is attained directly from a sludge by way of electrolysis.