Patents Assigned to EBN TECHNOLOGY CORP.
  • Patent number: 10818147
    Abstract: An assembled type sales terminal comprises: a flat panel sales terminal and a printer. The flat panel sales terminal includes: an operation display screen, disposed at one end of the flat panel sales terminal; an expansion assembling seat, disposed rotatably at the other end of the flat panel sales terminal, and connected thereto through using a hinge; and a first connection portion, disposed on a lower portion of the expansion assembling seat. The printer includes: a lift cover, having a paper roll placement port disposed thereon; a second connection portion, disposed on the printer, to work in cooperation with the first connection portion; and a placement plane, disposed at a lower portion of the printer. The flat panel sales terminal can be stacked on the printer to form into a body; or the former and the latter can be separated and juxtaposed side by side.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: October 27, 2020
    Assignee: EBN TECHNOLOGY CORP.
    Inventors: Tze-Yang Liu, Chien-Long Lin
  • Patent number: 10133102
    Abstract: A fast detachable placement seat structure for a display, that comprises: a flat panel display and a placement seat. The placement seat includes: a support plate, a bottom seat, a cable placement portion, and a fast detachable mechanism. The fast detachable mechanism includes at least a fastening portion, and at least a locking portion. The flat panel display is disposed in an electronic device. The bottom base is connected to the support plate to form an angle with the support plate, and is used for receiving circuits. The flexible design mentioned able is able to achieve fewer components required, simple structure, easy assembly/detachment, to save time for assembly and repair, and reduce production cost significantly. As such, that fast detachable placement seat structure for a display can be used in various electronic products having flat panel displays.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: November 20, 2018
    Assignee: EBN TECHNOLOGY CORP.
    Inventors: Tze-Yang Liu, Ding-Shiuan Lin, Wei-Shiang Liau
  • Patent number: 9648783
    Abstract: An enhanced heat dissipation module having multi-layer heat isolation, made of copper, aluminum, iron, or a combination thereof, includes a protection box, used to receive an electric circuit board. On protection box is provided with at least a notch corresponding to high heat generating electronic components on the electric circuit board. A heat dissipater is provided with a large heat dissipation area disposed opposite to protection box, and it includes at least a fix seat disposed in protrusion on the heat dissipater. The fix seat extends into the notch of the protection box, to contact fully surface of the high heat generating electronic components. An elastic contact plate, disposed in front of the fix seat, to press against surface of the high heat generating electronic components. A plurality of heat conduction tubes are pressed onto the heat dissipater, with one end connected to the fix seat.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: May 9, 2017
    Assignee: EBN TECHNOLOGY CORP.
    Inventor: Tze Yang Liu