Abstract: A white photosensitive resin composition, a white spacer, a light conversion layer, and a light-emitting device are provided. The white photosensitive resin composition includes a polymerizable compound (A), an alkali-soluble resin (B), a photopolymerization initiator (C), a solvent (D), and a white pigment (E). The polymerizable compound (A) includes an ethylenically-unsaturated monomer (A-1) represented by formula (I-1) and a thiol compound (A-2) having two or more thiol groups in one molecule, wherein based on 100 mass % of the polymerizable compound (A), a total content of the ethylenically-unsaturated monomer (A-1) and the thiol compound (A-2) is 10 mass % to 98 mass %.

Abstract: The photosensitive resin composition includes an alkali-soluble resin (A), an ethylenically-unsaturated monomer (B), a photopolymerization initiator (C), a solvent (D), and a pigment (E). The alkali- soluble resin (A) includes an alkali-soluble resin (A-1), wherein the alkali-soluble resin (A-1) includes a structural unit represented by formula (I-1) and a structural unit represented by formula (I-2). The photopolymerization initiator (C) includes an acylphosphine oxide compound represented by formula (III-1).

Abstract: A pipe connectable plastic bucket includes a bucket and at least two quick-connect devices. The bucket has a plurality of through holes for communication between the inside and the outside of the bucket. The at least two quick-connect devices respectively correspond to the plurality of through holes, and are disposed on the bucket. The at least two quick-connect devices are adapted to connect to pipes, and are used for allowing a fluid entering and exiting the bucket through the plurality of the through holes. The at least two quick-connect devices comprise a first quick-connect device for allowing the liquid to enter and to exit the bucket. The present invention also provides a method of using the pipe connectable plastic bucket.

Abstract: An etchant composition, a tackifier, an alkaline solution, a method of removing polyimide and an etching process are provided. The etchant composition includes a tackifier (A) and an alkaline solution (B). The tackifier (A) includes a resin containing a hydroxyl group (a), a surfactant (b) and a first solvent (c1). The alkaline solution (B) includes an alkaline compound (d) and a second solvent (c2).

Abstract: A photosensitive resin composition and a cured product are provided. The photosensitive resin composition includes an alkali-soluble resin (A), polymerizable monomer (B), an antioxidant (C), a photoinitiator (D) and a solvent (E). The weight average molecular weight of the alkali-soluble resin (A) is 5,000 to 40,000. The polymerizable monomer (B) includes an ethylenically unsaturated monomer (B1), an epoxy monomer (B2) or the combination thereof. The alkali-soluble resin (A) includes at least one of a structural unit represented by following Formula (A-1) to Formula (A-4). In Formula (A-1) to Formula (A-4), the definition of R1 to R3, m, n and * are the same as defined in the detailed description.

Abstract: A photosensitive resin composition and a cured product are provided. The photosensitive resin composition includes an alkali-soluble resin (A), polymerizable monomer (B), a thermal acid generator (D), a photoinitiator (E) and a solvent (F). The weight average molecular weight of the alkali-soluble resin (A) is 5,000-40,000. The polymerizable monomer (B) includes an epoxy monomer (B1), ethylenically unsaturated monomer (B2) or the combination thereof. The thermal acid generator (D) includes hexafluoroonium salt. The epoxy monomer (B1) includes a compound represented by following Formula (B-1). In Formula (B-1), the definition of X1 to X3 and Z4 to Z6 are the same as defined in the detailed description.

Abstract: A polyimide precursor, a preparation method thereof, a photosensitive resin composition and a cured product are provided. The polyimide precursor is obtained from a tetracarboxylic dianhydride (A), a diamine (B), and a hydroxyl-containing alkyl (meth)acrylate (C) through ring-opening substitution, and polymerization. The polyimide precursor does not include fluorine. The tetracarboxylic dianhydride (A) and the diamine (B) form a main chain. The hydroxyl-containing alkyl (meth)acrylate (C) is grafted to the main chain to form a branch. A molar ratio of the tetracarboxylic dianhydride (A) to the diamine (B) if from 1:0.95 to 1:1.10.

Abstract: A resin composition, an anti-etching layer and an etching method are provided. The resin composition includes a resin (A), a crosslinking agent (B), a surfactant (C), and a solvent (D). The resin (A) includes a hydroxyl type polystyrene resin (A-1), a hydroxyl type phenolic resin (A-2), a polyhydroxy phenol resin (A-3), or a combination thereof. The crosslinking agent (B) includes a structure of novolac epoxy resin type (B-1), polymethyl methacrylate type (B-2), maleimide type (B-3) or hyperbranched oligomer (B-4).

Abstract: An ink composition, a light conversion layer and a light emitting device are provided. The resin composition includes a quantum dot (A), a first resin (B1), a second resin (B2), an ethylenically unsaturated monomer (C), an initiator (D) and a solvent (E). The first resin (B1) is an alkali-insoluble resin, and the second resin (B2) is an alkali-soluble resin. The first resin (B1) includes a compound represented by the following Formula (1): In Formula (1), n is an integer from 1 to 10, X is benzene, toluene or naphthalene, and Y is toluene, methylnaphthalene, tetrahydrodicyclopentadiene, or 4,4?-dimethyl-1,1?-biphenyl.

Abstract: A resin composition and a cured film are provided. The resin composition includes a monomer mixture (A), a siloxane compound (B), a curing agent (C), and inorganic particles (D). The monomer mixture (A) includes a bisphenol fluorene compound (A-1) represented by Formula (I-1). The siloxane compound (B) has a group represented by Formula (II-a).

Abstract: A photosensitive resin composition, an optical film and a method of producing the same are provided. The photosensitive resin composition includes a thiol compound (A) having two or more groups represented by formula (I-a), a polyether-modified polysiloxane (B), an ethylenically unsaturated group-containing compound (C) having one or two aromatic rings, a bisphenol fluorene oligomer (D) having one or two (meth)acryloyl groups, and a photoinitiator (E).

Abstract: The present invention provides a method for forming a patterned polyimide layer with the use of a positive photoresist composition. The composition comprises a cresol-type novolac resin, a diazonaphthoquinone-based sensitizer and an organic solvent; based on the cresol-type novolac resin with a total amount of 100 parts by weight, the amount of the diazonaphthoquinone-based sensitizer ranges from 40 parts to 60 parts by weight, the amount of the free cresol in the cresol-type novolac resin is lower than 2 parts by weight, and the alkaline dissolution rate (ADR) of the cresol-type novolac resin in an aqueous solution of 3.5 wt % to 7 wt % tetramethylammonium hydroxide is lower than 285 ?/s. The positive photoresist composition has excellent chemical resistance to the polyimide stripper, and can specifically improve the protective ability of the photoresist layer to the low-dielectric polyimide layer, thereby optimizing the manufacturing process and quality of the patterned polyimide layer.

Abstract: A black resin composition, a cured film, and a black filter are provided. The black resin composition includes: a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), a photoinitiator (E), a UV absorber (F), and a surfactant (G). The resin (D) includes a first resin having a weight-average molecular weight of 2,000 to 20,000. The first resin includes a structural unit having a fluorene ring and two or more ethylenically-polymerizable groups. The UV absorber (F) includes a benzylidene-based derivative.

Abstract: A resin composition, a light conversion layer and a light emitting device are provided. The resin composition includes a quantum dot (A), an alkali-soluble resin (B), an ethylenically unsaturated monomer (C), a photoinitiator (D), a solvent (E) and a phenyl-based compound (F). The phenyl-based compound (F) includes at least one of a compound represented by following Formula (F-1) and a compound represented by following Formula (F-2). Based on a total usage amount of the resin composition as 100 parts by weight, a usage amount of the phenyl-based compound (F) is 0.05 to 5 parts by weight. In Formula (F-1) and Formula (F-2), the definition of R1, R3, R4, Y, Z, m, n and p are the same as defined in the detailed description.

Abstract: A black light-shielding photosensitive resin composition, a black matrix, a black light-shielding film, a frame, and a filling material for a splicing area are provided. The black light-shielding photosensitive resin composition includes a resin (A), a pigment (B), a monomer (C), an initiator (D), and a solvent (E). The resin (A) includes an epoxy resin (A-1) and a resin (A-2) having an ethylenic unsaturated functional group. The pigment (B) includes black particles (B-1) and hollow particles (B-2).

Abstract: A polyimide resin composition, a polyimide resin adhesive layer, a laminate, and a manufacturing method of an electronic component are provided. The polyimide resin composition includes a polyimide resin. The polyimide resin is obtained by the polymerization reaction of a diamine (A) and a tetracarboxylic dianhydride (B). The diamine (A) includes a diamine (A-1) represented by following Formula (I-1) and a diamine (A-2) represented by following Formula (I-2). A molar ratio ((A-1):(A-2)) of the diamine (A-1) to the diamine (A-2) is 0.1:0.2 to 0.6.

Abstract: A photosensitive resin composition for imprinting, a cured article and an optical element are provided. The photosensitive resin composition for imprinting includes a resin (A), an ethylenically unsaturated monomer (B), a photoinitiator (C), a solvent (D), and a hydrophobic oligomer (E). The resin (A) has a weight average molecular weight of 1,000 to 50,000 and has two or more ethylenic polymerizable groups.

Abstract: A flexible encapsulating material, a method for preparing the flexible encapsulating material, and an encapsulating method using the flexible encapsulating material are provided. The flexible encapsulating material includes an epoxy resin represented by a Formula (1), a curing agent, and a curing accelerator and optionally includes a coupling agent, wherein based on 100 parts by weight of a total usage amount of the epoxy resin (A), the curing agent (B), and the curing accelerator (C), a usage amount of the epoxy resin (A) is 85 parts by weight or more, and based on 100 parts by weight of the usage amount of the epoxy resin (A), a usage amount of the coupling agent (D) is 0 to 5 parts by weight.

Abstract: A black resin composition, a cured film, and a black filter are provided. The black resin composition includes: a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), a photoinitiator (E), a UV absorber (F), and a surfactant (G). The resin (D) includes a first resin having a weight-average molecular weight of 2,000 to 20,000. The first resin includes a structural unit having a fluorene ring and two or more ethylenically-polymerizable groups. The UV absorber (F) includes a benzylidene-based derivative.

Abstract: A white photosensitive resin composition, a white spacer, a light conversion layer, and a light-emitting device are provided. The white photosensitive resin composition includes a polymerizable compound (A), an alkali-soluble resin (B), a photopolymerization initiator (C), a solvent (D), and a white pigment (E). The polymerizable compound (A) includes an ethylenically-unsaturated monomer (A-1) represented by formula (I-1) and a thiol compound (A-2) having two or more thiol groups in one molecule, wherein based on 100 mass % of the polymerizable compound (A), a total content of the ethylenically-unsaturated monomer (A-1) and the thiol compound (A-2) is 10 mass % to 98 mass %.