Abstract: Methods for selective measurement and monitoring of multiple base chemicals in processing solutions are provided. Methods include providing a processing solution including a plurality of base chemicals and performing a first analytical method, such as measuring a conductivity of the solution blend, in combination with a second analytical method, such as titration or pH measurements of the solution. From such measurements, a concentration of one or more base chemicals can be selectively determined. In such methods, multiple bases in a same processing solution are advantageously selectively measured and monitored accurately.

Abstract: The disclosed subject matter relates to techniques for methods and systems for non-reagent chloride analysis in an acid copper plating bath, using a blend of VMS (Virgin Makeup Solution) to generate Ag+-containing solution as a titration into a sample.

Abstract: Techniques including methods and apparatuses for inert real-time measurement and monitoring of metal and acid concentrations in a processing solution are provided. Methods include performing an analytical method (e.g., spectral measurements) of the processing solution to determine a metal concentration and performing another analytical method (e.g., density measurements) of the processing solution to determine an acid concentration with compensation of raw results based on the determined metal concentration. The determination of the acid concentration can also include compensation of raw results based on another analytical method (e.g., temperature measurements) of the processing solution. The analytical methods can be performed in any order or in parallel. Both metal and acid concentrations in the processing solution can therefore be inertly and continuously measured and monitored in real time.

Abstract: The present disclosure provides methods for determining concentration of various trace metal ions in aqueous solutions, such as gold plating solutions. At a particular fixed reduction potential, the cathodic current can suddenly increase in magnitude after a certain period of time (e.g., an incubation time) passes in the presence of a trace metal ion (e.g., Tl(I)), where the incubation time is inversely proportional to the concentration of trace metal in the electrolyte. The concentration of the trace metal can be calculated after measuring the incubation time and comparing it against a calibration curve.

Abstract: Techniques for selective measurement and monitoring of boric acid concentrations in processing solutions are provided. Methods include the use of a complexing agent that reacts with hydrolyzing ions, for example, ethylenediaminetetraacetic (EDTA) acid salts in potentiometric titration. In such methods, a boric acid concentration in a processing solution can be accurately measured and monitored.

Abstract: Methods and apparatuses for selective monitoring of multiple silicon compounds in etchant solutions are provided. Methods can include reacting a test solution comprising a plurality of different silicon compounds with a fluoride-based compound in several conditions to provide different silicon:reagent binding ratios. One of the conditions can include the addition of a co-solvent to the test solution. Concentrations of the multiple silicon compounds can be determined based on the different binding ratios of silicon:reagent. Methods can further include a measuring method such as silicon elemental analysis or measuring of functional groups of a certain silicon form of a first portion of a test solution comprising a plurality of different silicon compounds and reacting a second portion of the solution with a fluoride-based compound to provide a silicon:reagent binding ratio. Concentrations of the multiple silicon compounds can be determined based on the measuring method and binding ratio measurements.

Abstract: Techniques including methods and apparatuses for selective measurement and monitoring of halide concentrations in processing solutions for iron triad metals and their alloys are provided. Methods include monitoring of a halide ion, for example, based on a first analytical method such as conductivity with a compensation of the results for a main metal concentration such as a second analytical measurement of concentration of an iron triad metal (e.g., nickel (Ni)). From such measurements, a concentration of certain halide ions can be selectively determined.

Abstract: The present disclosure relates to methods of monitoring the concentrations of silver ion and complexing agent in tin-silver (SnAg) electrodeposition solutions, and analysis and process control using such methods. Methods can include adding a precipitating agent to an electrodeposition solution including at least tin ions, silver ions, and complexing agent to cause a reaction between at least a portion of the precipitating agent and substantially all of the silver ions (to precipitate silver ions as a precipitant); adding a metallic salt to the electrodeposition solution to cause a reaction with substantially all of the remaining precipitating agent; measuring the endpoint of the silver ion back titration; further adding metallic salt to cause a further reaction with the complexing agent; and measuring the endpoint of the complexing agent titration.

Abstract: Systems and methods for adjusting a distance of an optical fiber end to a lens assembly are provided. Methods include adjusting a movement of an inner barrel in just one axis while preventing the inner barrel from spinning.

Abstract: Methods and apparatuses for selective monitoring of multiple silicon compounds in etchant solutions are provided. Methods can include reacting a test solution comprising a plurality of different silicon compounds with a fluoride-based compound in several conditions to provide different silicon:reagent binding ratios. One of the conditions can include the addition of a co-solvent to the test solution. Concentrations of the multiple silicon compounds can be determined based on the different binding ratios of silicon:reagent. Methods can further include a measuring method such as silicon elemental analysis or measuring of functional groups of a certain silicon form of a first portion of a test solution comprising a plurality of different silicon compounds and reacting a second portion of the solution with a fluoride-based compound to provide a silicon:reagent binding ratio. Concentrations of the multiple silicon compounds can be determined based on the measuring method and binding ratio measurements.

Abstract: Methods for measuring additive turnover in a solution, such as an electrodeposition solution, are provided. Methods for measuring an age or lifetime of a solution, such as an electrodeposition solution, are also provided. Methods can include providing a solution containing an organic additive and a plurality of breakdown products of the organic additive, in which the plurality of breakdown products include at least one active component and at least one inactive component and measuring the concentration of the at least one inactive component in the solution. Methods can further include determining additive turnover of the solution based on the concentration of the at least one inactive component in the solution.

Abstract: Methods for measuring additive turnover in a solution, such as an electrodeposition solution, are provided. Methods for measuring an age or lifetime of a solution, such as an electrodeposition solution, are also provided. Methods can include providing a solution containing an organic additive and a plurality of breakdown products of the organic additive, in which the plurality of breakdown products include at least one active component and at least one inactive component and measuring the concentration of the at least one inactive component in the solution. Methods can further include determining additive turnover of the solution based on the concentration of the at least one inactive component in the solution.

Abstract: The present disclosure relates to sampling devices for sampling solutions, such as high temperature chemical solutions, in certain industrial processes. The sampling device is integrated with a recirculation line from which a sample is drawn thereby reducing or preventing clogging of processes components resulting from precipitation of the solution.

Abstract: The present disclosure relates to methods of monitoring the concentrations of silver ion and complexing agent in tin-silver (SnAg) electrodeposition solutions, and analysis and process control using such methods. Methods can include adding a precipitating agent to an electrodeposition solution including at least tin ions, silver ions, and complexing agent to cause a reaction between at least a portion of the precipitating agent and substantially all of the silver ions (to precipitate silver ions as a precipitant); adding a metallic salt to the electrodeposition solution to cause a reaction with substantially all of the remaining precipitating agent; measuring the endpoint of the silver ion back titration; further adding metallic salt to cause a further reaction with the complexing agent; and measuring the endpoint of the complexing agent titration.

Abstract: The present disclosure relates to methods of monitoring the concentrations of silver ion and complexing agent in tin-silver (SnAg) electrodeposition solutions, and analysis and process control using such methods. Methods can include adding a precipitating agent to an electrodeposition solution including at least tin ions, silver ions, and complexing agent to cause a reaction between at least a portion of the precipitating agent and substantially all of the silver ions (to precipitate silver ions as a precipitant); adding a metallic salt to the electrodeposition solution to cause a reaction with substantially all of the remaining precipitating agent; measuring the endpoint of the silver ion back titration; further adding metallic salt to cause a further reaction with the complexing agent; and measuring the endpoint of the complexing agent titration.

Abstract: Methods for measuring total accelerator in a solution, such as an electrodeposition solution, are provided. Methods can include providing a solution containing an accelerator and one or more breakdown products of the accelerator, oxidizing the solution, and measuring the concentration of the accelerator in the solution. Methods can further include determining total accelerator based on the concentration of the accelerator in the solution.

Abstract: The present disclosure relates to methods of monitoring the concentrations of silver ion and complexing agent in tin-silver (SnAg) electrodeposition solutions, and analysis and process control using such methods. Methods can include adding a precipitating agent to an electrodeposition solution including at least tin ions, silver ions, and complexing agent to cause a reaction between at least a portion of the precipitating agent and substantially all of the silver ions (to precipitate silver ions as a precipitant); adding a metallic salt to the electrodeposition solution to cause a reaction with substantially all of the remaining precipitating agent; measuring the endpoint of the silver ion back titration; further adding metallic salt to cause a further reaction with the complexing agent; and measuring the endpoint of the complexing agent titration.

Abstract: The thickness of a palladium coating on copper (or another substrate) is measured by passing a cathodic current through a predetermined area of the coating in contact with an electrolytic solution and measuring the potential as a function of time. Protons from the electrolytic solution are electrochemically reduced to palladium hydride at cathodic potentials less negative than required for evolution of hydrogen. As formation of the PdH0.58 beta-phase throughout the Pd coating is completed, the cathodic potential increases rapidly to a cathodic potential plateau corresponding to evolution of hydrogen gas on the PdH0.58 surface. This step in the cathodic potential provides an endpoint time for the measurement. The absolute thickness of the Pd coating is calculated from the integrated cathodic charge passed up to the endpoint time and the predetermined area of the coating in contact with the electrolytic solution.

Abstract: Silicon ions in an alkaline etchant solution are analyzed by acidifying a sample of the etchant solution, adding fluoride ions in excess of the concentration required to react with all of the silicon ions, and using a fluoride ion specific electrode (FISE) to detect free fluoride ions in the resulting test solution. Good sensitivity and precision are provided by using a relatively acidic test solution and only a slight excess of fluoride ions, and limiting the analysis range to the maximum expected silicon concentration in the etchant solution.

Abstract: Silicon ions in an alkaline etchant solution are analyzed by acidifying a sample of the etchant solution, adding fluoride ions in excess of the concentration required to react with all of the silicon ions, and using a fluoride ion specific electrode (FISE) to detect free fluoride ions in the resulting test solution. Good sensitivity and precision are provided by using a relatively acidic test solution and only a slight excess of fluoride ions, and limiting the analysis range to the maximum expected silicon concentration in the etchant solution.