Abstract: Disclosed is a method for producing a shoe sole. The shoe sole includes: a shoe sole fabric having the form of a sole; a protective cover having the form corresponding to the form of the shoe sole fabric and bonded to a lower surface of the shoe sole fabric with a plurality of pillar through holes vertically penetrating the protective cover; and a plurality of pillar pieces passing through the plurality of pillar through holes, and bonded to the lower surface of the shoe sole fabric and arranged in a form of protruding downward from the protective cover.

Abstract: A method of recycling a large amount of insole scrap stack is proposed. The method includes forming a plate-shaped stack made of flat-plate-shaped foam and woven fabric, separating an insole scrap stack from the plate-shaped stack, and forming a pulverized insole scrap having an average diameter of 0.05 to 0.7 mm by cool-pulverizing or freeze-pulverizing the insole scrap stack at 10° C. or less. The pulverized insole scrap may be used for manufacturing foam.

Abstract: Disclosed is a method for producing a shoe sole. The shoe sole includes: a shoe sole fabric having the form of a sole; a protective cover having the form corresponding to the form of the shoe sole fabric and bonded to a lower surface of the shoe sole fabric with a plurality of pillar through holes vertically penetrating the protective cover; and a plurality of pillar pieces passing through the plurality of pillar through holes, and bonded to the lower surface of the shoe sole fabric and arranged in a form of protruding downward from the protective cover.

Abstract: An electrical heating bonding device 1 bonds a member M1 to be bonded, which is made of a metal, and a member M2 to be bonded, which is made of a resin. The electrical heating bonding device 1 includes: an upper electrode 11 and a lower electrode 12 which sandwich the member M1 to be bonded, and are electrically conductive with the member M1 to be bonded; a pressurizing unit 20 which applies pressure to a bonding surface between the member M1 to be bonded and the member M2 to be bonded; a temperature sensor 30 which detects a temperature of the member M1 to be bonded; and a control unit 40 which controls the pressurizing unit 20 to apply the pressure to the bonding surface, after the temperature detected by the temperature sensor 30 reaches a predetermined set temperature Ts.

Abstract: A current diffusion bonding apparatus (1) includes upper and lower electrodes (11, 12), which sandwich members to be bonded (M, M) and which are electrically conductible with the members to be bonded (M, M); a power supply unit (20), which supplies a current to the electrodes (11, 12); and a pressurizing unit (30), which applies a pressure to bonding surfaces S. If a temperature T detected by a temperature sensor (45) is a first set temperature T1 or lower, the pressurizing unit (30) applies a pressure to the bonding surfaces S while restricting the displacement of the members to be bonded (M, M), and if the temperature T exceeds the first set temperature T1, the pressurizing unit (30) applies a pressure based on the elastic force of a spring (35d), which elastically deforms according to the displacement of the members to be bonded (M, M), to the bonding surfaces S.

Abstract: An electrical heating bonding device 1 bonds a member M1 to be bonded, which is made of a metal, and a member M2 to be bonded, which is made of a resin. The electrical heating bonding device 1 includes: an upper electrode 11 and a lower electrode 12 which sandwich the member M1 to be bonded, and are electrically conductive with the member M1 to be bonded; a pressurizing unit 20 which applies pressure to a bonding surface between the member M1 to be bonded and the member M2 to be bonded; a temperature sensor 30 which detects a temperature of the member M1 to be bonded; and a control unit 40 which controls the pressurizing unit 20 to apply the pressure to the bonding surface, after the temperature detected by the temperature sensor 30 reaches a predetermined set temperature Ts.

Abstract: A current diffusion bonding apparatus (1) includes upper and lower electrodes (11, 12), which sandwich members to be bonded (M, M) and which are electrically conductible with the members to be bonded (M, M); a power supply unit (20), which supplies a current to the electrodes (11, 12); and a pressurizing unit (30), which applies a pressure to bonding surfaces S. If a temperature T detected by a temperature sensor (45) is a first set temperature T1 or lower, the pressurizing unit (30) applies a pressure to the bonding surfaces S while restricting the displacement of the members to be bonded (M, M), and if the temperature T exceeds the first set temperature T1, the pressurizing unit (30) applies a pressure based on the elastic force of a spring (35d), which elastically deforms according to the displacement of the members to be bonded (M, M), to the bonding surfaces S.