Patents Assigned to Ecointeriors Corp.
  • Publication number: 20220259868
    Abstract: A flooring panel (50) is provided with a quick-release adhesive sheet (10) such that the flooring panel (50) can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel (50) includes a top floor layer (52) attached or laminated to the adhesive sheet (10), which underlies the floor layer (52). The top flooring layer (52) can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc. (FIG. 8).
    Type: Application
    Filed: February 28, 2022
    Publication date: August 18, 2022
    Applicants: EcoInteriors Corp., OneFlor USA, LLC
    Inventors: David J. Kim, Chi-Jung Lin
  • Publication number: 20200378133
    Abstract: A flooring panel (50) is provided with a quick-release adhesive sheet (10) such that the flooring panel (50) can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel (50) includes a top floor layer (52) attached or laminated to the adhesive sheet (10), which underlies the floor layer (52). The top flooring layer (52) can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc. (FIG. 8).
    Type: Application
    Filed: February 11, 2020
    Publication date: December 3, 2020
    Applicant: EcoInteriors Corp.
    Inventors: David J. Kim, Chi-Jung Lin
  • Patent number: 10753100
    Abstract: A flooring panel is provided with a quick-release adhesive sheet such that the flooring panel can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel includes a top floor layer attached or laminated to the adhesive sheet, which underlies the floor layer. The top flooring layer can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: August 25, 2020
    Assignee: Ecointeriors Corp.
    Inventors: David J. Kim, Chi-Jung Lin