Patents Assigned to EcoPhysics AG
  • Apparatus for detecting CMP endpoint in acidic slurries
    Patent number: 6899784
    Abstract: An apparatus for measuring ammonia gas concentration in an ongoing chemical mechanical polishing (CMP) cycle utilizing an acidic CMP slurry, having the following components: a. A transferring means to collect a sample of the acidic CMP slurry; b. A converting means to convert the acidic CMP slurry to a basic slurry; c. A measuring means to measure the ammonia gas present in the basic slurry; d. A detection means to signal the end of an ongoing CMP cycle.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: May 31, 2005
    Assignees: International Business Machines Corporation, EcoPhysics AG
    Inventors: Leping Li, Steven G. Barbee, Scott R. Cline, James A. Gilhooly, Walter Imfeld, Werner Moser, Adrian Siegrist, Heinz Stunzi, Xinhui Wang, Cong Wei