Abstract: The invention relates to power converter circuits which are suitable, in particular, for mobile drive systems with stringent requirements in terms of weight minimization and availability as well as direct attachment to rotating field machines. Inter alia, the strictly modular design of the electronics and the very low expenditure on passive filter elements by virtue of the principle involved are characteristic.

Abstract: Embodiments of the present invention provide a device for measuring a temperature of a power semiconductor, having means for applying an alternating voltage to the power semiconductor, and means for measuring an impedance between the control terminal of the power semiconductor and the channel terminal of the power semiconductor, the impedance being dependent on a temperature-dependent control resistor integrated in the power semiconductor.

Abstract: The invention concerns a power electronic arrangement comprising an insulating substrate, a cooling element arranged beneath the insulating substrate and one or more power electronic components disposed on a respective metallization surface of the insulating substrate. Disposed on the surface of the insulating substrate is a metal layer portion which projects beyond the insulating substrate at all sides. The region of the metal layer portion, that projects beyond the insulating substrate, forms a metal flange which borders the insulating substrate. The cooling element, on its side towards the insulating substrate, beneath the insulating substrate, has one or more recesses, whereby a cavity delimited by the insulating substrate and wall surfaces of the one or more recesses is formed beneath the insulating substrate for receiving a liquid cooling agent. The metal flange is further connected to the cooling element.

Abstract: The invention concerns a power electronic arrangement comprising an insulating substrate, a cooling element arranged beneath the insulating substrate and one or more power electronic components disposed on a respective metallization surface of the insulating substrate. Disposed on the surface of the insulating substrate is a metal layer portion which projects beyond the insulating substrate at all sides. The region of the metal layer portion, that projects beyond the insulating substrate, forms a metal flange which borders the insulating substrate. The cooling element, on its side towards the insulating substrate, beneath the insulating substrate, has one or more recesses, whereby a cavity delimited by the insulating substrate and wall surfaces of the one or more recesses is formed beneath the insulating substrate for receiving a liquid cooling agent. The metal flange is further connected to the cooling element.