Patents Assigned to ECSI FIBROTOOLS, INC.
  • Apparatus and method of contact electroplating of isolated structures
    Patent number: 10480092
    Abstract: The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: November 19, 2019
    Assignee: ECSI Fibrotools Inc.
    Inventor: Igor V. Kadija
  • Apparatus and method of contact electroplating of isolated structures
    Patent number: 10184189
    Abstract: The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: January 22, 2019
    Assignee: ECSI FIBROTOOLS, INC.
    Inventor: Igor V. Kadija