Abstract: An apparatus and method for grounding an electronic module which is electrically interconnected with a terminal connecting block. The electronic module has a pin receiving port for electrically connecting a conductive pin thereto. A clip having a two-pronged clasp and a protruding conductive pin is attached to the electronic module with the protruding pin of the clip placed within the pin receiving port. A flat conductive strip is placed within the two-pronged clasp of the clip, wherein the clip electrically couples the electronic module with the conductive strap. The conductive strap is then electrically coupled to ground.