Patents Assigned to EDISON OPTO CRPORATION
  • DIMMABLE LIGHT-EMITTED DIODE (LED) PACKAGING STRUCTURE
    Publication number: 20150228629
    Abstract: A dimmable light-emitted diode (LED) packaging structure is described. The dimmable LED packaging structure employs a plurality of first fluorescent layers respectively positioned on some of a plurality of first types of LED chips to solve the problems of color temperature and light mixing uniformity. Further, a second fluorescent layer overlays the first fluorescent layers and a potion of the first types of LED chips to simplify the manufacturing step of dimmable LED packaging structure.
    Type: Application
    Filed: May 12, 2014
    Publication date: August 13, 2015
    Applicant: EDISON OPTO CRPORATION
    Inventors: Shang-Hsun Tsai, Chien-Jung Wu