Abstract: This invention is for a wedge for bonding an elongated conductor, such as a wire, to a bond pad on a microelectronic device. A wire passes through an aperture in the wedge into a pocket or an open notch. A sidewall on each side of the pocket or open notch prevents the wire from moving sideways. The wire passes over a foot that extends below the sidewalls by an amount sufficient to prevent the sidewalls from contacting the surface of the microelectronic device during bonding. The wire is bonded to a bond pad on a microelectronic device by feeding the wire through the aperture of the wedge and over the foot, pressing said wire between the foot and the bond pad, and applying bonding energy, such as ultrasonic energy, to the wire.

Abstract: This invention provides a high-output industrial light fixture that employs a plurality of commercially available fluorescent light sources in an array of adjustable arm assemblies each housing one or more light sources (fluorescent bulbs) in an associated reflector box or other source housing structure. By adjusting the arm assemblies, a more-precise spread of light onto the target surface can be achieved. Arm mounting brackets can be provided with one or more locking positions to facilitate multi-position angular placement of each individual arm. A plurality of arm assemblies can be provided around a center housing or hub, each directed outwardly in a radial direction from a central point or axis of the center housing/hub. Each arm's source reflector box/source housing structure can be located to project light either downwardly or upwardly and can be angled at a plurality of angular adjustment positions with respect to the center housing in each of the upward and/or downward positions.

Abstract: An improved rotary spray scrubber of the type including an elongate gas flow duct and a rotary dispersion hub is described. The improvement comprises maintaining the ratio of the hub diameter to the duct diameter in the range from about 0.55 to 0.75. The improved rotary scrubber is particularly effective at removing submicron particulates from a gas stream, with removals well above 90% being feasible.