Abstract: A vacuum system includes at least one cryopump; sensors associated with the cryopump, each of the sensors being configured to sense an operating condition of the cryopump; and diagnostic circuitry configured to receive signals sampled from the sensors. The diagnostic circuitry includes a diagnostic model of the cryopump, the diagnostic model being derived from historical data of a plurality of cryopumps of a same type operating over a plurality of regeneration and servicing time periods and being configured to relate values of the sampled signals from the at least some sensors to a probability of the pump failing within a predetermined time. The diagnostic circuitry is configured to apply the sampled signals to the diagnostic model and to determine the probability of the at least one cryopump failing within a predetermined time from an output of the model.

Abstract: A vacuum pump comprises an inlet flange for connecting to a vacuum chamber, where the inlet flange comprises a plurality of apertures for receiving a plurality of protruding fixing elements extending from the vacuum chamber. The protruding fixing elements comprise an enlarged retaining portion at an end remote from the vacuum chamber and a fastener receiving portion having at least one radial dimension that is smaller than a corresponding dimension of the enlarged retaining portion. A fastening mechanism is provided that comprises a plurality of slots each extending from a same side of a plurality of apertures. The fastening mechanism is configured to be rotatable between a mounting position in which the apertures are aligned with the protruding fixing elements and a sealing position in which the slots are aligned with the protruding fixing elements.

Abstract: A semiconductor wafer cooling system and method and a pressure regulating apparatus for mitigating pressure increases in a semiconductor wafer conditioning circuit are disclosed. The pressure regulating apparatus comprises: a buffer vessel, the buffer vessel comprising an inlet and outlet channel; wherein the inlet channel is configured in operation to be in fluid communication with a higher pressure location of the semiconductor wafer conditioning circuit, and the outlet channel is configured in operation to be in fluid communication with a lower pressure location. the inlet channel comprises a pressure controlled valve configured to close the inlet channel during normal operation such that the buffer vessel is isolated from the higher pressure location of the conditioning circuit and to open the inlet channel in response to the pressure within the semiconductor conditioning circuit rising above a predetermined level.

Abstract: Pump module for a vacuum apparatus with a flange which can be connected to a vacuum apparatus in a vacuum-tight manner, at least one ion getter pump and at least one volume getter pump, NEG, where the ion getter pump is directly connected to the flange and the NEG is directly connected to the ion getter pump and where the NEG and the flange are arranged separately from each other.

Abstract: A cryopump comprising: a vessel comprising a frontal open area, the frontal open area comprising an inlet to the vessel; a radiation shield; a two stage refrigerator extending into the vessel, a first stage of the refrigerator being thermally coupled to the radiation shield. A first stage array is arranged within the vessel and is also thermally coupled to the first stage of the refrigerator. A cryopanel structure is coupled to a second stage of the refrigerator. The first stage array comprises a plurality of elements arranged at increasing distances from the inlet, the element closest to the inlet being between the cryopanel structure and the inlet and elements further from the inlet having a passage through a central portion. The element closest to the inlet has a smaller outer perimeter than the elements further from the inlet.

Abstract: Flange for a vacuum apparatus comprises a housing to be connected to the vacuum apparatus defining an opening wherein the opening has rectangular narrow shape. The flange further comprises a metal seal arranged around the opening to create a vacuum tight seal.

Abstract: A cryopump comprising: a pump inlet, a two stage refrigerator; a first stage array thermally coupled to a first stage of said two stage refrigerator; and a cryopanel structure coupled to a second stage of said two stage refrigerator is disclosed. The cryopanel structure comprises at least three flat panels. The first stage array is mounted between the pump inlet and the cryopanel structure, and comprises a plurality of slats, the plurality of slats each being mounted such that a side of each of the plurality of slats closest to the cryopanel structure is substantially aligned and offset longitudinally with respect to a corresponding one of said at least three flat panels.

Abstract: Method for the regeneration of a volume getter pump in a vacuum apparatus with a volume getter pump and an ion getter pump where the operating voltage of the ion getter pump is reduced, the current through the ion getter pump is recorded for determination of the pressure in the vacuum apparatus and then a heating element of the NEG is controlled as a function of the current of the ion getter pump for the purpose of heating the NEG material.

Abstract: A cryopump with a pump inlet; a two stage refrigerator; a first stage array arranged thermally coupled to a first stage of the two stage refrigerator; and a cryopanel structure coupled to a second stage of the two stage refrigerator. Surfaces of the cryopanel structure have portions that are coated portion with an adsorbent material and other portions that are not coated with the adsorbent material.

Abstract: An ion pump controller configured to alternate between increasing and decreasing a potential difference between an anode and a cathode of an ion pump multiple times during the starting of pumping.

Abstract: A semiconductor waste abatement system for a semiconductor processing system includes a vacuum pump, an abatement apparatus having an abatement chamber in fluid communication with a source of semiconductor waste gas from the semiconductor processing chamber, and with the abatement chamber configured to ionize the waste gas and to exhaust ionized gas. The abatement system further includes a filter apparatus with a filter chamber, which forms a liquid reservoir. The inlet of the filter apparatus is in fluid communication with the outlet of the abatement chamber and the liquid reservoir, and the outlet of the filter apparatus is in communication with the inlet of the vacuum pump, wherein the filter chamber is under a vacuum, and wherein semiconductor waste gas is ionized in the abatement chamber and then filtered by the filter apparatus prior to input to the vacuum pump.

Abstract: A liquid filter apparatus for gas/solid separation includes a housing with a filter chamber, a semiconductor process gas inlet, and a process gas outlet. The filter chamber forms a liquid reservoir, and the semiconductor process gas inlet and the process gas outlet are in communication with the filter chamber. The housing further includes a filter liquid inlet and a filter liquid outlet, which are in communication with the liquid reservoir for delivering and removing filter fluid, respectively, to and from the liquid reservoir.

Abstract: A Gifford-McMahon cryogenic refrigerator comprises a reciprocating displacer within a refrigeration volume. The displacer is pneumatically driven by a drive piston within a pneumatic drive volume. Pressure in the pneumatic drive volume is controlled by valving that causes the drive piston to follow a programmed displacement profile through stroke of the drive piston. The drive valving may include a proportional valve that provides continuously variable supply and exhaust of drive fluid. In a proportionally controlled feedback system, the valve into the drive volume is controlled to minimize error between a displacement signal and a programmed displacement profile. Valving to the warm end of the refrigeration volume may also be proportional. A passive force generator such as a mechanical spring or magnets may apply force to the piston in opposition to the driving force applied by the drive fluid.

Abstract: A semiconductor processing system includes a semiconductor processing chamber, a pump, an exhaust line in fluid communication with the chamber through the pump, and a steam generator and reactor. The steam generator and reactor has a process conduit with an inlet in line in the exhaust line for generating superheated steam and effecting transformations of chemicals in the exhaust fluid flowing in exhaust line into the inlet.

Abstract: In a cryopump, a primary cryopumping array having adsorbent and cooled by a second refrigerator stage extends along radiation shield sides. That array is shielded by a condensing cryopumping array that extends along the primary cryopumping array. The primary cryopumping array may be a cylinder with adsorbent on an inwardly facing surface, and the condensing cryopumping array may comprise an array of baffles having surfaces facing the frontal opening. A raised surface such as a conical surface at the base of the radiation shield redirects molecules received from the frontal opening toward the primary cryopumping array. The refrigerator cold finger may extend tangentially relative to the radiation shield or connect to the base of the radiation shield.

Abstract: A cryopump has a cryogenic refrigerator with cold and colder stages that cool a radiation shield, a primary cryopumping array and a frontal array. The frontal array is coupled to the cold stage and is spaced from and wrapped around the frontally facing envelope of the primary cryopumping array. The frontal array may be recessed from the frontal opening and closer to the primary cryopumping array than to the frontal opening.

Abstract: A kit may include at least one frame lifting mechanism configured to be mounted within the support frame. The lifting mechanism may include a movable element configured to be movably mounted to the frame and an extendible member configured to extend between the movable element and a static member mounted on the frame. The movable element includes at least one support portion extending from a lower surface of the movable element when the movable element is mounted to the frame. The extendible member is configured to be movable between a compressed state and an extended state. The movable element is configured to be mounted to the frame such that on extension of the extendible member the movable element is pushed downwards and the at least one support portion moves below a base of the frame and provides a lifting force to the frame.

Abstract: A heat exchanger within an insulated enclosure receives primary refrigerant at a high pressure and cools the primary refrigerant using a secondary refrigerant from a secondary refrigeration system. An expansion unit within the insulated enclosure receives the primary refrigerant at the high pressure from the heat exchanger and discharges the primary refrigerant at a low pressure. A supply line delivers the primary refrigerant at the low pressure to the load and a return line returns the primary refrigerant from the load to the primary refrigeration system. A system control unit controls operation of at least one of the primary refrigeration system and the secondary refrigeration system to provide a variable refrigeration capacity to the load based on at least one of: a pressure of the primary refrigerant delivered to the load, and at least one temperature of the load.

Abstract: A Gifford-McMahon cryogenic refrigerator comprises a reciprocating displacer within a refrigeration volume. The displacer is pneumatically driven by a drive piston within a pneumatic drive volume. Pressure in the pneumatic drive volume is controlled by valving that causes the drive piston to follow a programmed displacement profile through stroke of the drive piston. The drive valving may include a proportional valve that provides continuously variable supply and exhaust of drive fluid. In a proportionally controlled feedback system, the valve into the drive volume is controlled to minimize error between a displacement signal and a programmed displacement profile. Valving to the warm end of the refrigeration volume may also be proportional. A passive force generator such as a mechanical spring or magnets may apply force to the piston in opposition to the driving force applied by the drive fluid.