Patents Assigned to Edyza, Inc.
  • Publication number: 20170366877
    Abstract: A modular sensor system may perform soil and water analysis at various depths. For instance, chemical composition may be determined and concentration and/or environmental parameters, such as pressure, temperature, and/or moisture, may be measured at different depths. A sensor bus head, at least one sensor rod, and a sensor bus terminus may be vertically stacked and interconnected through a bus network such that the system is modular and reconfigurable.
    Type: Application
    Filed: June 17, 2017
    Publication date: December 21, 2017
    Applicant: Edyza, Inc.
    Inventors: Mohammed Rana Basheer, Atul A. Patel
  • Publication number: 20170363451
    Abstract: A modular sensor system may include a sensor bus architecture configured for interchangeable sensor modules. Stackable sensor modules, such as rods, may have input/output (I/O) connectivity. The sensor modules may interconnect with a sensor bus head, a sensor bus terminus, and/or one another. The uppermost sensor module may connect to the sensor bus head, and the lowermost sensor module may connect to the sensor bus terminus. Between the sensor bus head and the sensor bus terminus, various sensor modules may be connected. The modular arrangement of the sensors in the system of some embodiments is provided such that the sensors are interconnected through a sensor bus network. The sensor bus communication scheme may allow hot-swapping of sensors and relatively low power operation for energy-constrained sensor data collection applications.
    Type: Application
    Filed: June 17, 2017
    Publication date: December 21, 2017
    Applicant: Edyza, Inc.
    Inventors: Mohammed Rana Basheer, Atul A. Patel