Abstract: A photonic integrated circuit including an InP-based substrate that is provided with a first InP-based optical waveguide and a neighboring second InP-based optical waveguide, a dielectric planarization layer that is arranged at least between the first optical waveguide and the second optical waveguide. At least between the first optical waveguide and the neighboring second optical waveguide, the dielectric planarization layer is provided with a recess that is arranged to reduce or prevent optical interaction between the first optical waveguide and the second optical waveguide via the dielectric planarization layer. At the location of the recess, the dielectric planarization layer has a first sidewall that is arranged sloped towards the first optical waveguide, and a second sidewall that is arranged sloped towards the second optical waveguide. An opto-electronic system including said PIC.

Abstract: A monolithic InP-based PIC having a first photonic assembly that has a first optical splitter-combiner unit having a first end part that is optically connected with a first optical waveguide and a second end part that is optically connected with a first main photonic circuit and a first auxiliary photonic circuit. The first auxiliary photonic circuit has a first laser unit, and a first SOA. The first SOA is configurable to be in a first operational state in which the first SOA allows optical communication between the first laser unit and the first optical splitter-combiner unit, or a second operational state in which the first SOA prevents optical communication between the first laser unit and the first optical splitter-combiner unit. An opto-electronic system including the PIC.

Abstract: An environmentally protected PIC, including an InP-based substrate having a first surface that is at least partially provided with an InP-based optical waveguide, and a dielectric protective layer arranged to cover at least the first surface of the InP-based substrate and the InP-based optical waveguide. The dielectric protective layer is configured to protect said PIC from environmental contaminants, to enable confinement of optical radiation in the dielectric protective layer in at least one direction that is transverse to a direction of propagation of the optical radiation, and to allow exchange of the optical radiation between the InP-based optical waveguide and the dielectric protective layer. An opto-electronic system including PIC.

Abstract: A photonic integrated circuit including first and second opto-electronic devices that are fabricated on a semiconductor wafer having an epitaxial layer stack including an n-type indium phosphide-based contact layer that is provided with at least one selectively p-type doped tubular-shaped region for providing an electrical barrier between respective n-type contact regions of the first and second opto-electronic devices that are optically interconnected by a passive optical waveguide that is fabricated in a non-intentionally doped waveguide layer including indium gallium arsenide phosphide, the non-intentionally doped waveguide layer being arranged on top of the n-type contact layer, wherein a first portion of the at least one selectively p-type doped tubular-shaped region is arranged underneath the passive optical waveguide between the first and second opto-electronic devices. An opto-electronic system including the photonic integrated circuit.

Abstract: An optical subassembly (1) includes a photonic integrated circuit (2), an external optical system (4) and an optical interface (6) that is arranged between the PIC and the external optical system. The optical subassembly includes a third material (7) and a fourth material (8). The third material (7) at least partially fills the optical interface between the PIC and the external optical system in order to minimize contamination of any kind. The fourth material (8) being in contact at least with the third material for sealing at least the third material from ambient moisture. In this way a low-cost near-hermetic environmental protection barrier (7, 8) may be provided. An optical system (14) including the optical subassembly and a method of fabricating such an optical subassembly are also described.

Abstract: An integrated photonic component (1) is provided with improved centering of an optical field image of a wavelength division multiplexing, WDM, optical output signal and a common output waveguide (8). In this way an efficient power coupling of the laser diodes of the integrated photonic component to the common output waveguide is achievable. Also provided is a photonic integrated circuit, PIC, for use in a WDM optical communication system, the PIC including the integrated photonic component. A method of improving centering of an optical field image of a WDM signal and a common output waveguide of at least one of the integrated photonic component and the PIC are also described.

Abstract: Disclosed is an optical subassembly (1) including a carrier substrate (2), a photonic integrated circuit (3) (PIC) including a first optical waveguide (4) having a first longitudinal central axis, the PIC being arranged on the carrier substrate, an external optical system (5) including a second optical waveguide (6) having a second longitudinal central axis, a component (7) for supporting the external optical system on the carrier substrate and maintaining alignment of the first and second longitudinal central axes with respect to each other, and an adhesive material (8, 9) being arranged between the component and the carrier substrate and between the component and the external optical system, the adhesive material having a total thickness of less than 10 ?m. Also disclosed is an optical system (12) including such optical subassembly and a method of fabricating such optical subassembly.

Abstract: Disclosed is an optical subassembly (1) including a carrier substrate (2), a photonic integrated circuit (3) (PIC) including a first optical waveguide (4) having a first longitudinal central axis, the PIC being arranged on the carrier substrate, an external optical system (5) including a second optical waveguide (6) having a second longitudinal central axis, a component (7) for supporting the external optical system on the carrier substrate and maintaining alignment of the first and second longitudinal central axes with respect to each other, and an adhesive material (8, 9) being arranged between the component and the carrier substrate and between the component and the external optical system, the adhesive material having a total thickness of less than 10 ?m. Also disclosed is an optical system (12) including such optical subassembly and a method of fabricating such optical subassembly.

Abstract: An integrated photonic component (100) for polarization insensitive wavelength multiplexing includes an arrayed waveguide grating, AWG, (1) having a predetermined polarization splitting and a MZI-based polarization beam splitter (8) that is configured to compensate the predetermined polarization splitting of the AWG (1). The result is a fabrication tolerant integrated photonic component (100) that is operable over a wide number of limited bandwidth wavelength channels of a wavelength division multiplexing, WDM, system. A photonic integrated circuit, PIC, (200) for use in a WDM system is provided. The PIC (200) includes the integrated photonic component (100). A method of designing the integrated photonic component (100) is also described.

Abstract: An assembly (60) includes a substrate (1) that is provided with at least one electrical contact (3a), a flexible printed circuit membrane (51) including an electrically insulating film (6) and an electrically conducting layer (7) that is at least partially covering the insulating film (6). The conducting layer (7) is at least locally accessible from outside of the membrane (51). A connection element (10) is provided for electrically connecting the at least one electrical contact (3a) and the conducting layer (7) at a position where the conducting layer (7) is accessible, to form an electrical connection between the substrate (1) and the membrane (51). A chip package (70) includes a housing (15) having at least one electrically conducting terminal, and an assembly (60) as mentioned. The flexible printed circuit membrane (51) is arranged for electrically connecting the substrate and the at least one terminal of the housing (15).

Abstract: An assembly (60) includes a substrate (1) that is provided with at least one electrical contact (3a), a flexible printed circuit membrane (51) including an electrically insulating film (6) and an electrically conducting layer (7) that is at least partially covering the insulating film (6). The conducting layer (7) is at least locally accessible from outside of the membrane (51). A connection element (10) is provided for electrically connecting the at least one electrical contact (3a) and the conducting layer (7) at a position where the conducting layer (7) is accessible, to form an electrical connection between the substrate (1) and the membrane (51). A chip package (70) includes a housing (15) having at least one electrically conducting terminal, and an assembly (60) as mentioned. The flexible printed circuit membrane (51) is arranged for electrically connecting the substrate and the at least one terminal of the housing (15).