Abstract: A laser processing system has a platform to support a work piece to be processed, a laser to operate on the work piece, a laser control system to control operation of the laser, and a system control to provide instructions to the laser control system based upon at least the work piece to be processed.

Abstract: A method of fabricating a conductive line provides a substrate having a blanket layer of conductive material disposed thereon, a removing of a first portion of the blanket layer of conductive material to form one or more gaps that define a first line, the gaps adjacent to the first line, the first line having at least a first segment of a first width and a second segment of a second width, the first and second widths being different, a first increasing of the width of a first gap of the one or more gaps, the first gap adjacent to the first segment, by a first amount, and a second increasing of the width of a second gap of the one or more gaps, the second gap adjacent to the second segment, by a second amount wherein the first and second increasing depend upon a desired electrical characteristic. The first amount and the second amount may be different from each other.

Abstract: A substrate includes a first metal layer containing a first trace, a second metal layer containing a second trace and a dielectric layer arranged between the first and second metal layers. The substrate also includes an electrically conductive signal via electrically coupled to the first and second traces traversing the dielectric layer to form a signal path, wherein physical characteristics of the via are controlled such that signal path characteristics of the via match signal path characteristics of the first and second traces.