Patents Assigned to EFP Corp.
  • Patent number: 4781555
    Abstract: A mold has mold walls defining a cavity and a plurality of heated fluid inlets communicating with the cavity. An enclosed frame for storing a heated fluid is positioned about the mold. Valves are positioned completely within the enclosed frame and each of the valves is coupled to one of the heated fluid mold inlets.
    Type: Grant
    Filed: January 7, 1987
    Date of Patent: November 1, 1988
    Assignee: EFP Corp.
    Inventor: Charles A. Cook