Patents Assigned to Eften, Inc.
  • Process for bonding a cover to a substrate
    Patent number: 5868890
    Abstract: A process for making a composite substrate with cover utilizes heated dies of a forming tool to deform and heat the substrate. The heated substrate is then placed in a marriage tool having a room temperature lower die for receiving the substrate, and a heated upper die. A cover material layer is placed over the substrate and the marriage tool is closed. The cover material includes a heat activatable adhesive and with the marriage tool closed, the heat from the upper die adheres the cover material layer to the substrate while the room temperature die cools the substrate. In this way, when the marriage tool is opened, the composite structure can be removed without deformation.
    Type: Grant
    Filed: November 22, 1996
    Date of Patent: February 9, 1999
    Assignee: Eften, Inc.
    Inventor: John Fredrick
  • All synthetic fiber interior trim substrate
    Patent number: 5866235
    Abstract: An interior trim substrate and method of making same uses a corrugated synthetic fiber liner having upper and lower sides. An upper synthetic fiber liner is bonded to the upper side of the corrugated liners and a lower synthetic fiber liner is bonded to the lower side of the corrugated synthetic fiber liner. In this way, an all synthetic fiber headliner substrate which is or can be made 100% recyclable, is formed.
    Type: Grant
    Filed: February 21, 1997
    Date of Patent: February 2, 1999
    Assignee: Eften, Inc.
    Inventors: John Fredrick, Harold H. Zaima
  • Moldable foam composite
    Patent number: 5134014
    Abstract: A heat moldable composite panel is particularly useful as an automotive headliner and other as structural parts which must have heat and sound insulating properties as well as sound absorbing properties. The panel comprises a corrugated core which is advantageously dual arched core or corrugated metal foil, with opposite sides. One side is covered by a linerboard and is attached to the core through thermoplastic adhesive. The opposite side is covered by a thermoformable foam layer which is attached to the core by heat activatable adhesive. The entire structure is formable in a molding die at relatively low temperatures.
    Type: Grant
    Filed: January 28, 1991
    Date of Patent: July 28, 1992
    Assignee: Eften, Inc.
    Inventors: Harold H. Zaima, J. Christopher Landry
  • Method of making thermoformably shaped fibreboard sandwich structures
    Patent number: 5022943
    Abstract: A shaped panel and method of manufacture thereof comprises an open-cell core having multiple cells with cell walls extending perpendicularly to the opposite sides of the core. Linerboard covers one or both sides of the core with thermoplastic resin being provided as adhesive between the core and the one or more linerboards. The resulting sandwich structure is heated and shaped in a mold.
    Type: Grant
    Filed: August 25, 1989
    Date of Patent: June 11, 1991
    Assignee: Eften, Inc.
    Inventor: Harold H. Zaima