Abstract: A reservoir for the introduction of a preform of solid brazing filler metal is formed by a recess in the outer wall of an electronic component package and opens into a package through-hole. A lead-wire and bushing are placed within the through-hole with allowance for a clearance space so as to permit liquefaction and capillary diffusion of the filler metal within the space.
Type:
Grant
Filed:
November 15, 1991
Date of Patent:
December 7, 1993
Assignee:
Egide S.A.
Inventors:
Marc Catheline, Jean-Noel Dody, Jean-Pierre Maquaire
Abstract: A package for electronic components and especially hybrid components comprises a base, an enclosure formed by lateral walls and a lid having the function of hermetically sealing the package while bearing on a top end of the lateral walls. At least one lateral wall having through-holes for conductors which serve to establish a connection between the interior of the package and the exterior is provided with at least one longitudinal groove in an upper portion located between the through-holes and the top end of the wall.
© 2026 Justia
