Abstract: A new family of palladium based metallization catalyst compositions is diosed.These catalysts are used in a process for the selective deposition of a metal on a substrate when a metallization mask (i.e. a plating resist) is used over the substrate.Processes and compositions are also disclosed for manufacturing printed circuit boards, by using two metallization sequences, or one alone the latter comprising a so-called "selective process."The process and composition are generally employed for the electroless plating of substrates, namely the metallization of plastics, ceramics, anodized aluminum and other materials.
Type:
Grant
Filed:
February 8, 1991
Date of Patent:
October 5, 1993
Assignee:
Eid-Empresa de Investigacao e Desenvolvimento de Electronica S.A.
Inventors:
Jose M. G. Gomes, Ana P. T. L. Rodrigues