Patents Assigned to EKC/DuPont Electronics Technologies
  • Compositions and processes for photoresist stripping and residue removal in wafer level packaging
    Patent number: 7579308
    Abstract: Improved compositions and processes for removing photoresists, polymers, post etch residues, and post oxygen ashing residues from interconnect, wafer level packaging, and printed circuit board substrates are disclosed. One process comprises contacting such substrates with mixtures containing an effective amount of organic ammonium compound(s); from about 2 to about 20 weight percent of oxammonium compound(s); optionally organic solvent(s); and water.
    Type: Grant
    Filed: May 2, 2005
    Date of Patent: August 25, 2009
    Assignee: EKC/DuPont Electronics Technologies
    Inventor: Wai Mun Lee