Abstract: A heat transfer system comprising a primary heat exchanger for receiving heat from a heat source; a secondary heat exchanger for exhausting heat to a heat sink; a conduit connecting the primary heat exchanger and the secondary heat exchanger; and an electrokinetic pump for pumping a heat exchange fluid between the primary heat exchanger and the secondary heat exchanger through the conduit.
Type:
Grant
Filed:
April 19, 2004
Date of Patent:
July 14, 2009
Assignee:
Eksident Technologies, Inc.
Inventors:
Phillip H. Paul, Deon S. Anex, Don W. Arnold