Patents Assigned to EKUBIK CONSULTING LLC
  • INTEGRATED CAPACITOR FOR WAFER LEVEL PACKAGING APPLICATIONS
    Publication number: 20060258048
    Abstract: A capacitor design, which incorporates a material set that is adaptable to standard substrate or electronic packaging fabrication methods, uses copper as a base and electrode, mesoporous nanocomposite materials or other adhesion promoting materials combined with a high dielectric material specific to the application's capacitance requirements. This capacitor is then used as a basis for forming a capacitor in substrate or package or wafer level package or die or wafer.
    Type: Application
    Filed: July 26, 2006
    Publication date: November 16, 2006
    Applicant: EKUBIK CONSULTING LLC
    Inventor: JOAN VRTIS