Abstract: Resin composition comprising a) the reaction product of a1) one or more epoxy compounds having at least 2 epoxy groups, and a2) sorbic acid as component A; b) a solvent containing vinyl groups as component B; characterized in that a bisphenol F diglycidyl ether or an epoxy novolac is used as epoxy compound a1) in component A.

Abstract: The present invention relates to a solvent-free wire enamel composition containing extrudable, polyesterimide-containing binders, prepared from polyols, polycarboxylic acids, imide-forming components, and structural elements which are crosslinkable after extrusion.

Abstract: Epoxy resin composition comprising a) the reaction product formed from a1) one or more epoxy compounds having at least two epoxy groups, and a2) 0.2 to 0.9 mol of acrylic acid or methacrylic acid or mixtures thereof per mole of epoxy groups, as component A; b) a solvent comprising vinyl groups as component B.

Abstract: Resin composition comprising a) the reaction product of a1) one or more epoxy compounds having at least 2 epoxy groups, and a2) sorbic acid as component A; b) a solvent containing vinyl groups as component B; characterized in that a bisphenol F diglycidyl ether or an epoxy novolac is used as epoxy compound a1) in component A.

Abstract: Resin composition comprising a) the reaction product of a1) one or more epoxy compounds having at least 2 epoxy groups, and a2) sorbic acid as component A; b) a solvent containing vinyl groups as component B.

Abstract: The invention relates to compositions which contain polyorganosiloxanes, a hydrosilylation catalyst, an inhibitor or moderator and doped pyrogenic titanium dioxide, to the use thereof for applying protective coatings to an electrical or electronic component or device and to the protective coatings as such.

Abstract: One-component, solvent-free organosiloxane composition comprising a) a linear or branched polyorganosiloxane containing at least two alkenyl or alkynyl groups, as component A; b) a linear or branched polyorganosiloxane containing at least 3 Si—H groups, as component B; c) a hydrosilylation catalyst as component C; d) an alkynol of the general formula (I) wherein R1, R2, R3 are selected independently of one another from H, C1-C6-alkyl and substituted or unsubstituted C3-C6-alkyl; or R1 is selected from H, C1-C6-alkyl and substituted or unsubstituted C3-C6-cycloalkyl, and R2, R3 are bonded together and form a 3- to 8-membered ring which can be substituted by one or more C1-C3-alkyl groups, as component D; and e) a fumed silica as component E.

Abstract: The invention relates to compositions which contain polyorganosiloxanes, a hydrosilylation catalyst, an inhibitor or moderator and doped pyrogenic titanium dioxide, to the use thereof for applying protective coatings to an electrical or electronic component or device and to the protective coatings as such.

Abstract: Fiber-matrix material curable thermally by radical polymerization, comprising (A) a polymeric matrix curable thermally by radical polymerization, (B) at least one kind of reinforcing fibers and (C) at least one particulate initiator of the radical polymerization, having an average particle size of 5 nm to 500 ?m, as measured by static light scattering, and selected from the group consisting of benzpinacol and substituted benzpinacols; processes for producing it, and its use for producing fiber-reinforced thermoset moldings.

Abstract: Described is a polyurethane wire enamel composed of at least one blocked polyisocyanate adduct, blocked with alkylphenols, at least one hydroxy polyester comprising ester and/or imide and/or amide groups, at least one hydrocarbon-based organic solvent, and further auxiliaries and additives.

Abstract: Reactive system comprising at least one component (I) composed of particles in very finely divided form present in a liquid phase of at least one further component (II) with which component (I) is capable of reacting following activation through energy supply, wherein component (I) is not soluble in component (II), process for preparation and use.

Abstract: A process is proposed for preparing hydroxyaromatics by heterogeneous catalytic reaction of hydroxyaromatics with C1-C4-alkanols in a microreactor (10), comprising the steps of: a) introducing the hydroxyaromatic and at least one compound selected from the group consisting of C1-C4-alkanols as reactants into at least one inlet orifice (22) of the microreactor (10) comprising at least one microreactor unit (18), b) passing the reactants through at least one microreactor unit (18) of the microreactor (10), said unit comprising a multitude of microchannels (28), said microchannels (28) having a lateral extent of less than 1 mm, and a heterogeneous catalyst being incorporated in the microchannels (28) for conversion of the reactants, c) passing the hydroxyaromatics prepared out through at least one outlet orifice (24) of the microreactor (10).

Abstract: Electrical insulating resin comprising A) isohexidediol diglycidyl ether, B) a hardener, C) an optional filler, D) further optional additives. The isohexidediol diglycidyl ether is preferably an isosorbide diglycidyl ether, isomannide diglycidyl ether or isoidide diglycidyl ether.

Abstract: Solvent composition comprising ethanol, aromatic hydrocarbon or hydrocarbon mixture, high-boiling solvent, wire enamel formulation based on polyvinyl formal and comprising the solvent composition, preparation process and use.

Abstract: One-component, solvent-free organosiloxane composition comprising a) a linear or branched polyorganosiloxane containing at least two alkenyl or alkynyl groups, as component A; b) a linear or branched polyorganosiloxane containing at least 3 Si—H groups, as component B; c) a hydrosilylation catalyst as component C; d) an alkynol of the general formula (I) wherein R1, R2, R3 are selected independently of one another from H, C1-C6-alkyl and substituted or unsubstituted C3-C6-alkyl; or R1 is selected from H, C1-C6-alkyl and substituted or unsubstituted C3-C6-cycloalkyl, and R2, R3 are bonded together and form a 3- to 8-membered ring which can be substituted by one or more C1-C3-alkyl groups, as component D; and e) a fumed silica as component E.

Abstract: Compositions comprising at least one epoxy resin and/or reactive diluents, at least one hardener for the at least one epoxy resin, at least one curing indicator, wherein the color of the composition changes depending on the curing degree, a process for determining sufficient cure of a composition comprising providing a composition comprising at least one epoxy resin and a hardener for the epoxy resin, adding a curing indicator, applying curing conditions to the colored composition until the composition changes its color and use of polymeric colorants as curing degree indicator, wherein the curing indicator is a polymeric colorant consisting of chromophores which are chemically bound to polymers having reactive groups.

Abstract: The present invention relates to a solvent-free wire enamel composition containing extrudable, polyesterimide-containing binders, prepared from polyols, polycarboxylic acids, imide-forming components, and structural elements which are crosslinkable after extrusion.

Abstract: Fibre-matrix material curable thermally by radical polymerization, comprising (A) a polymeric matrix curable thermally by radical polymerization, (B) at least one kind of reinforcing fibres and (C) at least one particulate initiator of the radical polymerization, having an average particle size of 5 nm to 500 ?m, as measured by static light scattering, and selected from the group consisting of benzpinacol and substituted benzpinacols; processes for producing it, and its use for producing fibre-reinforced thermoset mouldings.

Abstract: Resin composition comprising a) the reaction product of a1) one or more epoxy compounds having at least 2 epoxy groups, and a2) sorbic acid as component A; b) a solvent containing vinyl groups as component B.

Abstract: Epoxy resin composition comprising a) the reaction product formed from a1) one or more epoxy compounds having at least two epoxy groups, and a2) 0.2 to 0.9 mol of acrylic acid or methacrylic acid or mixtures thereof per mole of epoxy groups, as component A; b) a solvent comprising vinyl groups as component B.