Patents Assigned to Elantech Devices Corporation
  • Patent number: 7262682
    Abstract: A stress sensor in which the direction and magnitude of a stress being applied to a post bonded to or integrated with an insulating board can be grasped from variation in the resistance of resistor elements being stimulated by application of the stress while suppressing variation in the shape of each resistor. The resistor element comprises a resistor formed, by screen print, between a pair of electrodes for the resistor element, i.e. circuit pattern electrodes, arranged on the surface of the insulating board. The electrode is connected, through a conductor, with a board terminal part arranged at one end of the insulating board. The electrode and the conductor or a print accuracy adjusting member have a constant height from the surface of the insulating board. Arrangement of the conductor, electrode and print accuracy adjusting member is entirely identical or similar for the resistor elements in the vicinity thereof.
    Type: Grant
    Filed: June 2, 2006
    Date of Patent: August 28, 2007
    Assignee: Elantech Devices Corporation
    Inventors: Etsuo Ooba, Atsuomi Inukai, Fumiaki Karasawa, Hiroshi Yajima
  • Patent number: 7151431
    Abstract: A stress sensor in which the direction and magnitude of a stress being applied to a post (6) bonded to or integrated with the surface of an insulating board (3) can be grasped from variation in the resistance of a plurality of resistor elements (8) being stimulated by application of the stress while suppressing variation in the shape of each resistor (2). The resistor element (8) comprises a resistor (4) formed, by screen print, between a pair of electrodes for the resistor element, i.e. circuit pattern electrodes (1), arranged on the surface of the insulating board (3). The electrode is connected, through a conductor (9), with a board terminal part (5) arranged at one end of the insulating board (3). The electrode (1) and the conductor (9) or a print accuracy adjusting member (7) have a constant height from the surface of the insulating board (3).
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: December 19, 2006
    Assignee: Elantech Devices Corporation
    Inventors: Etsuo Ooba, Atsuomi Inukai, Fumiaki Karasawa, Hiroshi Yajima
  • Patent number: 7040182
    Abstract: A stress sensor having a post (6) fixed to or integrated with the surface of an insulation substrate (1) capable of determining the direction and magnitude of a stress applied to the post (6) from changes in the characteristics of a strain gauge (2) made by a stimulus to the strain gauge (2) caused by the stress, wherein a stress to the post (6) can be converted efficiently into changes in the characteristics of the strain gauge (2). Consequently, the stress sensor has a strain gauge (2)-disposed member provided with a locally-easy-to-deform portion where the strain gauge (2) is disposed. The strain gauge (2) is a resistance element (8) and is disposed on the surface of the insulation substrate (1), the insulation substrate mainly contains a resin material, and the easy-to-deform portion is preferably a thin-wall portion (7).
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: May 9, 2006
    Assignee: Elantech Devices Corporation
    Inventor: Hideyuki Teraoka
  • Patent number: 6993982
    Abstract: A stress sensor enduring against long-term use is provided. Accordingly, a substrate (4), which is used as both a sensor part (1) and a supporting part (2), functions as a stress sensor, in which the sensor part (1) has means for deforming a part thereof in response to a given stress and strain gauges (5) having a function for varying electric properties in response to the deformation, and in which the deforming part has a stress dispersing means (10).
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: February 7, 2006
    Assignee: Elantech Devices Corporation
    Inventors: Fumiaki Karasawa, Etsuo Ooba, Hiroshi Yajima