Abstract: A low-resistance nickel-chromium-based thin film resistor and method for forming same. A nickel-chromium alloy film is coated on at least one side with a layer of gold, the resulting gold-coated alloy film is heated at a temperature and for a time effective to cause diffusion of sufficient gold into the nickel-chromium film to lower its resistance to a desired value, and the gold layer is then removed, to leave a nickel-chromium-gold composite film resistor.

Abstract: A system and method for adjusting the capacitance value of thin film capacitors during fabrication is provided. During formation of metal film capacitor plates on capacitor regions of a substrate, adjustment patterns comprised of multiple parallel adjustment lines corresponding to adjustment percentages of the capacitance value are formed in an area of the substrate adjacent to the capacitor regions. Selected adjustment lines of the adjustment patterns are offset aligned with corresponding lines of a photolithographic mask used during formation of the metal film capacitor plates in a re-etching process to selectively reduce the area of the capacitor plates to produce the desired decrease in capacitance value.

Abstract: A system and method for adjusting the capacitance value of thin film capacitors during fabrication is provided. During formation of metal film capacitor plates on capacitor regions of a substrate, adjustment patterns comprised of multiple parallel adjustment lines corresponding to adjustment percentages of the capacitance value are formed in an area of the substrate adjacent to the capacitor regions. Selected adjustment lines of the adjustment patterns are offset aligned with corresponding lines of a photolithographic mask used during formation of the metal film capacitor plates in a re-etching process to selectively reduce the area of the capacitor plates to produce the desired decrease in capacitance value.

Abstract: An electronic circuit package in which a resistor network is readily installed and remains accessible for laser trimming after final assembly of the package. A substrate is provided having a circuit pattern on a surface thereof and terminating in electrical terminals for connection to external circuitry. The substrate includes an aperture about the periphery of which a plurality of contact pads are arranged and in connection with intended paths of the circuit pattern. A resistor network is formed on a surface of a smaller substrate, the resistors being connected to contact pads disposed about the periphery of the smaller substrate and configured to be in alignment with respective pads at the aperture of the larger substrate. The smaller substrate is placed on the larger substrate with the respective contact pads in alignment, and the engaged contact areas are bonded to mechanically retain the smaller substrate and to electrically interconnect the resistor network with the associated circuit pattern.