Abstract: A multilayer electronic component according to an exemplary embodiment of the present disclosure may control connectivity of an end of an internal electrode, thereby suppressing occurrence of a short circuit between the internal electrodes, reduced capacitance or lower breakdown voltage. The internal electrode may include a plurality of conductor portions and a plurality of cut-off portions.

Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. A region, containing nickel (Ni) and carbon (C), is present between the internal electrode layer and the dielectric layer.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in ascending numerical order along an optical axis from an object side of the optical imaging system toward an imaging plane of an image sensor, wherein TTL/(2*IMG HT)?0.67 is satisfied, where TTL is a distance along the optical axis from an object-side surface of the first lens to the imaging plane of the image sensor, and IMG HT is one half of a diagonal length of the imaging plane of the image sensor, and 15<v1-v3<45 is satisfied, where v1 is an Abbe number of the first lens, and v3 is an Abbe number of the third lens.

Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on one surface of the body. The external electrode includes a conductive base and a glass disposed in the conductive base, and the glass includes 0.01 wt % or more to 5.8 wt % or less of nitrogen (N) based on a total weight of the glass.

Abstract: A camera module includes a first prism having refractive power, a first lens module disposed adjacently to an object-side surface of the first prism, and a first driving member driving the first lens module in a direction intersecting an optical axis.

Abstract: A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction and a cover portion disposed on one surface and the other surface of the capacitance forming portion in the first direction, and external electrodes disposed on the body, wherein a secondary phase including Al is disposed at an interface between the internal electrode and the dielectric layer, and the ratio of an area occupied by the secondary phase to an area of the capacitance forming portion is 0.03% or more and 0.40% or less.

Abstract: A non-line-of-sight radar apparatus includes a first radar receiver to convert a first frequency radar signal received through a non-line-of-sight into a digital signal and to output a first path signal; a first signal processor to receive a second path signal from a direct-line-of-sight detection apparatus detecting a direct-line-of-sight, to cancel a direct-line-of-sight signal irrelevant to the non-line-of-sight included in the first path signal using the second path signal, and to extract a non-line-of-sight signal; and a first signal detector to detect an object on a non-line-of-sight based on the non-line-of-sight signal.

Abstract: An imaging lens system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens, sequentially disposed at intervals from an object side of the imaging lens system. The imaging lens system satisfies 1.5<Nd5<1.6, 30<V5<50, and TTL/2IH<0.730, where Nd5 is a refractive index of the fifth lens, V5 is an Abbe number of the fifth lens, TTL is a distance from an object side surface of the first lens to an imaging plane, and 2IH is a diagonal length of the imaging plane.

Abstract: An optical imaging system includes a first lens having positive refractive power, a second lens having refractive power, a third lens having refractive power, a fourth lens having refractive power, a fifth lens having negative refractive power, wherein the first to fifth lenses are sequentially disposed from an object side, and a reflective member having a plurality of reflective surfaces to reflect the light refracted by the fifth lens multiple times, wherein 3<BFL/TL<7 is satisfied, where BFL is a distance on an optical axis from an image-side surface of the fifth lens to an imaging plane, and TL is a distance on an optical axis from an object-side surface of the first lens to the image-side surface of the fifth lens.

Abstract: A multilayer electronic component including: a body including a capacitance formation portion, cover portions disposed on surfaces on the capacitance formation portion opposing each other in one direction, and margin portions disposed on surfaces of the capacitance formation portion opposing each other in another direction; a first external electrode; a second external electrode, and the cover portions include a first-first buffer layer connected to the first external electrode and a first-second buffer layer connected to the second external electrode, and the margin portions include a second-first buffer layer connected to the first external electrode and a second-second buffer layer connected to the second external electrode, and the first-first buffer layer and the second-first buffer layer are connected to each other, and the first-second buffer layer and the second-second buffer layer are connected to each other.

Abstract: A printed circuit board including a first insulating layer; a plurality of first circuit patterns respectively disposed on the first insulating layer; and a plurality of second circuit patterns respectively disposed on the first insulating layer and respectively having a thickness, thinner than a thickness of each of the plurality of first circuit patterns. At least one of the plurality of first circuit patterns and at least one of the plurality of second circuit patterns are alternately and repeatedly arranged, and a method for manufacturing the printed circuit board, are provided.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens having a convex object-side surface, a fifth lens having a concave image-side surface, and a sixth lens, wherein the first to sixth lenses are sequentially disposed from an object side to an imaging plane. An F-number of the optical imaging system is 1.7 or less.

Abstract: An optical imaging system includes a first lens group that can move in an optical direction and has negative refractive power; a second lens group that can move in the optical direction and has positive refractive power; and a third lens group that can move in the optical direction and has negative refractive power. The first lens group, the second lens group, and the third lens group include seven lenses in total, and at least one of the seven lenses includes an aspherical surface.

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: a body including a dielectric layer and internal electrodes; and an electrode layer disposed on the body and connected to the internal electrodes; and the electrode layer includes Cu particles and glass, wherein oxides including Cu is disposed on at least a portion of the interface between the Cu particles and the glass.

Abstract: A printed circuit board including a first insulating layer; a plurality of first circuit patterns respectively disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer and covering a portion of a side surface of each of the plurality of first circuit patterns; and an insulator disposed between at least one pair of adjacent first circuit patterns, among the plurality of first circuit patterns, and integrated with the first insulating layer, and a method for manufacturing a printed circuit board, are provided.

Abstract: A coil component includes: a body having a first and a second surface opposing, and including first and second recesses respectively formed in the first and the second surface; a support member disposed in the body; a coil including a first coil portion disposed on one surface of the support member, a sub-lead portion extending from an outermost turn of the first coil portion to the first surface, a first lead portion disposed on other surface of the support member and connected to the sub-lead portion, a second coil portion disposed on the other surface of the support member, and a second lead portion extending from an outermost turn of the second coil portion to the second surface, wherein a thickness of the sub-lead portion is less than that of the first coil portion, and a width of the sub-lead portion is less than that of the first lead portion.

Abstract: A coil component includes a body having a first surface and including first and second recessed-cutout portions spaced apart from each other on the first surface of the body, a support substrate, a coil unit disposed on the support substrate to be perpendicularly to the first surface of the body, and first and second external electrodes spaced apart from each other on the first surface of the body and connected to first and second lead patterns of the coil unit, respectively. The first and second external electrodes include conductive resin layers filling the first and second recessed-cutout portions to be in contact with the first and second lead patterns, each of the conductive resin layers having a first surface exposed to the first surface of the body, and the first and second external electrodes further include electrode layers disposed on the first surfaces of the conductive resin layers.

Abstract: A multilayer electronic component including: a body including a dielectric layer and internal electrodes; and external electrodes disposed outside the body and connected to the internal electrodes, wherein 1.5?Hfs/Hfc?5.0 when the internal electrode includes hafnium (Hf), Hfc indicates an average Hf content (at %) in a center of the internal electrode, and Hfs indicates an average Hf content (at %) in the internal electrode, measured from the center of the internal electrode to an interface thereof in contact with the dielectric layer.

Abstract: A printed circuit board includes an insulating layer; an interconnection layer disposed on the insulating layer, and including a plurality of metal pads for mounting a semiconductor chip thereon; and a solder resist layer disposed on the insulating layer and covering the interconnection layer, the solder resist layer having a plurality of openings respectively exposing at least a portion of at least one of the plurality of metal pads. A rectangular region created by substantially connecting outer edges of outermost openings among the plurality of openings in a straight line is substantially equally divided into a plurality of cells, and a ratio of areas of the metal pads disposed in each cell to an area of each cell is calculated, and when a maximum value thereof is PMax and a minimum value thereof is PMin, (PMax?PMin)*100?20.

Abstract: A method of manufacturing a multilayer electronic component including: a first operation of obtaining a layer pattern constituting one layer by performing at least one of a process of forming a dielectric pattern by ejecting a ceramic ink containing a dielectric material and a photocurable resin, a process of forming an internal electrode pattern by ejecting a first metal ink containing conductive particles for internal electrodes and a photocurable resin, and a process of forming external electrode patterns by ejecting a second metal ink containing conductive particles for external electrodes and a photocurable resin; a second operation of obtaining a cured layer pattern by irradiating the layer pattern with ultraviolet light to cure the layer pattern; obtaining a laminate in which a plurality of cured layer patterns are stacked by carrying out a plurality of the first and second operations; and sintering the laminate.