Patents Assigned to Electro Sceintific Industries, Inc.
  • Method for Laser Singulation of Chip Scale Packages on Glass Substrates
    Publication number: 20100248451
    Abstract: An improved method for singulation of compound electronic devices is presented. Compound electronic devices are manufactured by combining two or more substrates into an assembly containing multiple devices. Presented are methods for singulation of compound electronic devices using laser processing. The methods presented provide fewer defects such as cracking or chipping of the substrates while minimizing the width of the kerf and maintaining system throughput.
    Type: Application
    Filed: March 27, 2009
    Publication date: September 30, 2010
    Applicant: Electro Sceintific Industries, Inc.
    Inventors: Peter Pirogovsky, Jeffery A. Albelo, James O'Brien, Yasu Osako