Abstract: Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. The temporal pulse profile includes a first portion that defines a first time duration, and a second portion that defines a second time duration. A method includes generating a laser pulse based on laser system input parameters configured to shape the laser pulse according to the temporal pulse profile, detecting the generated laser pulse, comparing the generated laser pulse to the temporal pulse profile, and adjusting the laser system input parameters based on the comparison.

Abstract: A process to laser micro-machine a metal part with a high cosmetic quality surface, including applying a protective coating layer to at least one surface of the part to physically isolate the surface from air prior to micro-machining the part with a laser, and sacrificing the protective layer to block/consume oxygen in air by carbonization and oxidation due to strong laser irradiation. The protective coating applied to at least one of a front side high quality cosmetic surface and a back side surface of the part. The coating layer being highly transparent to an applied laser beam, having a thickness of between approximately 5 mil and approximately 10 mil, inclusive, and having sufficient adhesion strength to adhere to the part without delaminating during processing. The laser can be selected from a nano-second pulse width laser and a micro-second pulse width laser to process the part.

Abstract: A compensation tool and process is provided for calibrating each test position located at a plurality of test modules of an electronic testing machine to a standardized value. Each test module is located on an angularly spaced radial line extending from an associated central axis and has a plurality of contacts for testing electronic components. The compensation tool can include a body having an axis of rotation coaxially alignable with the central axis for rotation to different angular positions, and a component-support member operably associated with the body for indexing movement to selectively align with different contacts associated with each test position located at each of the plurality of test modules. The component-support member can include a pocket for receiving an electronic component with terminated ends extending outwardly to allow electrical contact and testing of each test position located at each the plurality of test modules.

Abstract: An electronic testing machine includes a plurality of test modules. Each test module has a plurality of contact pairs for testing electronic components. An apparatus and process for electrical test setup and calibration of the electronic testing machine includes a plate having at least one contact per track movable between test positions to electrically insert a test device selectively between any one contact pair, and a control program. The test device can be selected from a group consisting of a volt meter, a current meter, a precision voltage/current source, a calibration resistor, and a calibration capacitor. The control program can perform at least one test function through the plate. The test function can be selected from a group consisting of alignment verification, voltage/current source verification, insulation resistance (IR) leakage measurement verification, part-present contact check verification, capacitance and dissipation (CD) measurement verification, IR/CD compensation, and IR/CD calibration.

Abstract: In an electronic testing machine including at least one test module having a plurality of contacts for testing electronic components, the improvement of a contact alignment tool for aligning the contacts including a body to be positioned relative to the testing machine such that the body can be radially indexed along a path to a contact alignment test position proximate the contacts of the test module, and a plurality of circuits associated with the body, each circuit including at least one output signal connection and at least one open contact station, each open contact station defined by at least one open circuit trace pattern, such that each open contact station will be closed by the contacts when the body is located at the contact test position proximate the contacts and the contacts are properly aligned. A method and apparatus for aligning contacts of an electronic testing machine including at least one test module having a plurality of contacts.

Abstract: The present invention provides a method and an apparatus for evaluating the surfaces of substrates for three dimensional defects. The present invention uses low-angled lighting positioned on opposite sides of the substrate. A camera positioned above the substrate captures two images thereof, one using the first light source and one using the second. The first and second images are subtracted from one another to create a third image. Camera data suggestive of three dimensional features is emphasized by subtracting the two images and can be evaluated. A fourth image may be created by selecting the minimum values between the first and second images on a point-by-point basis. The fourth image also provides useful information in evaluating three dimensional defects.

Abstract: A coaxial narrow angle dark field imaging system is provided. The system utilizes a telecentric lens to illuminate objects with symmetric coaxial narrow angle dark field illumination. The illumination technique is particularly suited to highlight minor features or defects on planar specular objects. In particular, the coaxial light source directs light rays towards a telecentric lens which redirects the light rays towards the substantially planar specular object. The light rays are reflected back through the telecentric lens towards a camera. To the extent that the light rays are reflected from a planar specular portion of the object the light rays are blocked by a telecentric stop. Light rays reflected from a defect or feature in the planar specular object will pass through an aperture in the stop to a camera.

Abstract: A multiple axis modular controller and a method of operating the controller in a system comprising input devices receiving indications of system conditions and output devices performing tasks affecting the system conditions. The controller includes input connectors connectable to the input devices and output connectors connectable to the output devices. A processor executes a series of sequential commands of an application program. A command can be executed in response to completion of one sequential command of the series of sequential commands regardless of a next sequential command in the series of sequential commands or in response to a specified input received at one of the input connectors or in response to a specified output sent to one of the output connectors. The processor does not execute the command, minimizing processor delays.

Abstract: The present invention solves the problem of repeated operator intervention in a vision system by providing multiple templates which may be used to locate an object within an image.

Abstract: The coplanarity of leads (14) of an integrated circuit (IC) in a surface-mount technology package (SMT) (10) can be determined by means of a plurality of views without the use of a conventional pedestal (20), without the use of an associated Z-axis actuator, and without the associated delays required to deploy such a Z-axis actuator. In the invention, three leads (14) of SMT package (10) are arbitrarily selected to define a virtual reference plane (50) in a first or virtual coordinate system, and the positions of the unselected leads are measured with reference to the virtual reference plane (50). For convenience, the virtual reference plane (50) can be defined as Z=0 and may have height coordinates in Z that are negative or positive with respect to the virtual reference plane (50). The virtual coordinates are analyzed, and three leads (14) having the lowest Z coordinates are determined to define a virtual sitting plane (60).

Abstract: A surface mount component outer surface inspection system comprising a loader for assembling an inventory of surface mount components and feeding them outward in controlled rectilinear manner and in a timed sequence, a first transfer assembly including a first moving endless belt in racetrack pattern, the belt having a partially perforated outer surface and a vacuum pulled through the perforations from the outer surface along a portion of the belt, for receipt of and retaining the surface mount components from the loader in spaced-apart arrangement on the belt, a surface-mount component, upper-surface viewing device for bringing the exposed surfaces of the moving components into focus at an area for inspecting them for visual defects, a second transfer assembly including a second moving endless belt in racetrack pattern, the belt having a partially perforated outer surface and a vacuum pulled through the perforations from the outer surface along a portion of the belt, the second assembly adjacent the first en

Abstract: A method of profiling the border of termination paste applied to a chip capacitor electrode comprising the steps of casting a layer of termination paste of finite thickness; passing a profiling element through the upper part of the layer of paste, the element having an exterior profile that is arranged to dip into the paste and scrape some of the paste from the upper part of the paste layer to form a reverse profile in the layer of the paste; and, dipping a chip capacitor electrode into the paste layer at the reverse profile formed therein, to terminate the capacitor with the profile formed in the paste.