Patents Assigned to Electroform Company, Inc.
  • Patent number: 8113820
    Abstract: Method and apparatus for molding and assembling a composition part assembly in, for example, a plastic injection-molding machine. Complementary mold portions associated with a mold plate and rotatable turret form plural parts. Assembly apparatus associated with the turret assembles the plural parts into an assembly. A further turret may be provided to add a complementary part to the assembly to make a final assembly. The method includes manufacture of composite part assemblies and final assemblies.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: February 14, 2012
    Assignee: Electroform Company, Inc.
    Inventor: Wade L. Clark
  • Publication number: 20110206796
    Abstract: Method and apparatus for molding and assembling a composite part assemblies in, for example, a plastic injection-molding machine. Complementary mold portions associated with a mold plate and rotatable turret form plural parts. Assembly apparatus associated with the turret assembles the plural parts into an assembly. A further turret may be provided to add a complementary part to the assembly to make a final assembly. The method includes manufacture of composite part assemblies and final assemblies.
    Type: Application
    Filed: February 24, 2011
    Publication date: August 25, 2011
    Applicant: Electroform Company, Inc.
    Inventor: Wade L. Clark
  • Publication number: 20070284784
    Abstract: Method and apparatus for molding and assembling a composite part assemblies in, for example, a plastic injection-molding machine. Complementary mold portions associated with a mold plate and rotatable turret form plural parts. Assembly apparatus associated with the turret assembles the plural parts into an assembly. A further turret may be provided to add a complementary part to the assembly to make a final assembly. The method includes manufacture of composite part assemblies and final assemblies.
    Type: Application
    Filed: June 13, 2006
    Publication date: December 13, 2007
    Applicant: Electroform Company, Inc.
    Inventor: Wade L. Clark