Patents Assigned to Electronic Devices, Inc.
  • Patent number: 11901268
    Abstract: An external terminal electrode is attached to a frame, and the frame contains a first resin, and has a first adhered surface. A heat sink plate supports the frame, has an unmounted region where a power semiconductor element is to be mounted within the frame in plan view, is made of metal, and has a second adhered surface. An adhesive layer contains a second resin different from the first resin, and adheres the first adhered surface of the frame and the second adhered surface of the heat sink plate to each other. One of the first and second adhered surfaces includes a flat portion and a protruding portion. The protruding portion protrudes from the flat portion and opposes the other one of the first adhered surface and the second adhered surface with the adhesive layer therebetween.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: February 13, 2024
    Assignees: NGK Electronics Devices, Inc., NGK INSULATORS, LTD.
    Inventors: Yoshio Tsukiyama, Teppei Yamaguchi
  • Publication number: 20220151060
    Abstract: A terminal substrate includes a signal terminal disposed on a terminal surface of an insulation ceramic layer. An insulation resin layer of a flexible substrate includes a first surface facing the terminal surface, and a second surface on an opposite side of the first surface. A first signal pad disposed on the first surface is joined to the signal terminal. A first penetration conductive part penetrates the insulation resin layer from the first signal pad. A first signal line is disposed on the second surface. A second penetration conductive part penetrates the insulation resin layer from the first signal line. A second signal line is disposed on the first surface. A third penetration conductive part penetrates the insulation resin layer from the second signal line. A second signal pad is disposed on the second surface.
    Type: Application
    Filed: August 24, 2021
    Publication date: May 12, 2022
    Applicants: NGK Electronics Devices, Inc., NGK Insulators, Ltd., Fujitsu Optical Components Limited
    Inventors: Noboru KUBO, Masato ISHIZAKI, Kento TAKAHASHI
  • Publication number: 20220077011
    Abstract: A first frame is supported by a heat sink plate, surrounds an unmounted region of the heat sink plate, contains a resin, and has a first surface. A second frame contains a resin, and has a second surface opposing the first surface. An external terminal electrode passes between the first surface and the second surface. An adhesive layer contains a resin, and includes a lower portion, an upper portion, and an intermediate portion. The lower portion connects the external terminal electrode and the first surface to each other. The upper portion connects the external terminal electrode and the second surface to each other. The intermediate portion is disposed within a through hole of the external terminal electrode, and connects the lower portion and the upper portion to each other.
    Type: Application
    Filed: November 19, 2021
    Publication date: March 10, 2022
    Applicants: NGK Electronics Devices, Inc., NGK Insulators, Ltd.
    Inventors: Yoshio TSUKIYAMA, Akiyoshi OSAKADA, Teppei YAMAGUCHI
  • Publication number: 20220077033
    Abstract: An external terminal electrode is attached to a frame, and the frame contains a first resin, and has a first adhered surface. A heat sink plate supports the frame, has an unmounted region where a power semiconductor element is to be mounted within the frame in plan view, is made of metal, and has a second adhered surface. An adhesive layer contains a second resin different from the first resin, and adheres the first adhered surface of the frame and the second adhered surface of the heat sink plate to each other. One of the first and second adhered surfaces includes a flat portion and a protruding portion. The protruding portion protrudes from the flat portion and opposes the other one of the first adhered surface and the second adhered surface with the adhesive layer therebetween.
    Type: Application
    Filed: November 19, 2021
    Publication date: March 10, 2022
    Applicants: NGK Electronics Devices, Inc., NGK Insulators, Ltd.
    Inventors: Yoshio TSUKIYAMA, Teppei YAMAGUCHI
  • Publication number: 20220020651
    Abstract: A frame is made of a first material. An external terminal electrode is attached to the frame. A heat sink plate supports the frame and includes a mounting region in the frame. The heat sink plate is made of a non-composite material containing copper with purity of 95.0 weight percentage or more. A first adhesive layer bonds the frame and the heat sink plate to each other. The first adhesive layer is made of a second material different from the first material, and has a first composition. A power semiconductor element is mounted on the mounting region of the heat sink plate. A cover is attached to the frame to constitute a sealing space sealing the power semiconductor element without gross leak. A second adhesive layer bonds the frame and the cover to each other, and has a second composition different from the first composition of the first adhesive layer.
    Type: Application
    Filed: October 1, 2021
    Publication date: January 20, 2022
    Applicants: NGK Electronics Devices, Inc., NGK Insulators, Ltd.
    Inventors: Yuhji UMEDA, Yoshio TSUKIYAMA, Haruhiko ITO
  • Publication number: 20210404066
    Abstract: A metal member includes a metal substrate, a first intermediate plating layer, a second intermediate plating layer, and a precious metal plating layer. The metal substrate includes a surface constituted of a plurality of crystal grains. The first intermediate plating layer is directly formed on the plurality of crystal grains of the metal substrate, contains a nickel element, and is non-oriented with respect to each crystal orientation of the plurality of crystal grains of the metal substrate. The second intermediate plating layer is directly formed on the first intermediate plating layer. The precious metal plating layer is formed on the second intermediate plating layer.
    Type: Application
    Filed: September 10, 2021
    Publication date: December 30, 2021
    Applicants: NGK Electronics Devices, Inc., NGK Insulators, Ltd.
    Inventor: Shigeru YOSHIMURA
  • Patent number: 11178762
    Abstract: A connection structure for a wiring substrate and a flexible substrate including a wiring substrate and a flexible substrate, in which the wiring substrate includes an insulating member, conductor layer, and ground layer, the flexible substrate includes an insulating sheet and metal film, and the metal film includes a signal line pad joined to the conductor layer via a joining material when viewed from the back surface of the flexible substrate. When viewed from behind the flexible substrate, there is an overlap region where the signal line pad and conductor layer overlap. In a cross-section when the overlap region is cut in a direction perpendicular to a signal transmission direction, in a case where a width of the signal line pad including the overlap region is W, and a width of the conductor layer including the overlap region is W0, the connection structure satisfies W0<W.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: November 16, 2021
    Assignees: NGK Electronics Devices, Inc., NGK Insulators, Ltd.
    Inventors: Takashi Kawamura, Masato Ishizaki, Naoki Gotou
  • Publication number: 20200214130
    Abstract: A connection structure for a wiring substrate and a flexible substrate including a wiring substrate and a flexible substrate, in which the wiring substrate includes an insulating member, conductor layer, and ground layer, the flexible substrate includes an insulating sheet and metal film, and the metal film includes a signal line pad joined to the conductor layer via a joining material when viewed from the back surface of the flexible substrate. When viewed from behind the flexible substrate, there is an overlap region where the signal line pad and conductor layer overlap. In a cross-section when the overlap region is cut in a direction perpendicular to a signal transmission direction, in a case where a width of the signal line pad including the overlap region is W, and a width of the conductor layer including the overlap region is W0, the connection structure satisfies W0<W.
    Type: Application
    Filed: March 3, 2020
    Publication date: July 2, 2020
    Applicants: NGK Electronics Devices, Inc., NGK Insulators, Ltd.
    Inventors: Takashi KAWAMURA, Masato ISHIZAKI, Naoki GOTOU
  • Patent number: 9119297
    Abstract: An electronic component element housing package is produced by firing a ceramic substrate for housing an electronic component element and a metal layer for bonding to the ceramic substrate to form an electrical path, simultaneously in a reducing atmosphere. The ceramic substrate comprises alumina (Al2O3), a partially stabilized zirconia by forming solid solution with yttria (Y2O3) and a sintering agent. The sintering agent comprises magnesia (MgO), and at least 1 type selected from silica (SiO2), calcia (CaO), or manganese oxides (MnO, MnO2, Mn2O3, Mn3O4).
    Type: Grant
    Filed: May 1, 2013
    Date of Patent: August 25, 2015
    Assignee: Nippon Steel & Sumikin Electronics Devices Inc.
    Inventor: Masanori Nagahiro
  • Patent number: 7632716
    Abstract: A package for high frequency usages 10 has a notched area 16 on each longitudinal end of a substantially rectangular heat sink plate 11 for fastening the package to a base 20 with a screw. The package includes a joined member 17 formed by joining a surface of a ring-like frame member 12 made of a ceramic material to the longitudinal center of a surface of heat sink plate 11 and joining another surface to an external connection terminal 15. The other surface of heat sink plate 11 presents a curved protruding shape 18 bowing from its longitudinal ends toward its longitudinal center, so that curved protruding shape 18 causes at least an area of the other surface heat sink plate 11 that corresponds to an area dedicated for mounting a semiconductor device 19 within ring-like frame member 12 to make a close contact with base 20 when the package is fastened to base 20 by the screw at notched areas 16.
    Type: Grant
    Filed: May 9, 2006
    Date of Patent: December 15, 2009
    Assignee: Sumitomo Metal (SMI) Electronics Devices, Inc.
    Inventors: Ichirou Muraki, Kouichi Nakasu, Akiyoshi Osakada
  • Patent number: 7164331
    Abstract: An RF choke for minimizing hum modulation in a coaxial cable system that carries broadband signals along with high amperage 60 Hz AC power signals. The choke contains two conductors wound about a rod core. The first conductor includes two groups of clockwise windings each containing three turns. The second conductor wound counterclockwise also contains two groups of winding one of which contains four turns and the other of which contains three turns. The two connectors are separated by a space of about 0.20? and a 750 ohm resistor is placed in parallel over the second group of winding in the first conductor and a second 510 ohm resistor is placed in parallel over the first group of windings in the second conductor.
    Type: Grant
    Filed: December 30, 2004
    Date of Patent: January 16, 2007
    Assignee: National Electronics Devices Inc
    Inventor: Prabhakara V. Reddy
  • Publication number: 20060193116
    Abstract: A package for high frequency usages 10 has a notched area 16 on each longitudinal end of a substantially rectangular heat sink plate 11 for fastening the package to a base 20 with a screw. The package includes a joined member 17 formed by joining a surface of a ring-like frame member 12 made of a ceramic material to the longitudinal center of a surface of heat sink plate 11 and joining another surface to an external connection terminal 15. The other surface of heat sink plate 11 presents a curved protruding shape 18 bowing from its longitudinal ends toward its longitudinal center, so that curved protruding shape 18 causes at least an area of the other surface heat sink plate 11 that corresponds to an area dedicated for mounting a semiconductor device 19 within ring-like frame member 12 to make a close contact with base 20 when the package is fastened to base 20 by the screw at notched areas 16.
    Type: Application
    Filed: May 9, 2006
    Publication date: August 31, 2006
    Applicant: Sumitomo Metal (SMI) Electronics Devices Inc.
    Inventors: Akiyoshi Osakada, Ichirou Muraki, Kouichi Nakasu
  • Patent number: 7023084
    Abstract: The present invention provides a high heat dissipation plastic package and a method for making the same that provides an inexpensive, thin high heat dissipation plastic package with good bonding precision and minimal bleeding of adhesive resin. A Cu foil resin film is formed by bonding an adhesive resin to a Cu foil and pre-forming, at an essentially central position, a cut-out for a cavity used to mount a semiconductor element. The Cu foil resin film is bonded using the adhesive resin directly to a heat dissipation plate. A conductor wiring pattern is formed on the Cu foil resin film. Furthermore, the heat dissipation plate includes a stopping section used to prevent resin from bleeding onto a cavity when bonding with the adhesive resin of the Cu foil resin film.
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: April 4, 2006
    Assignee: Sumitomo Metal (SMI) Electronics Devices Inc.
    Inventors: Shigehisa Tomabechi, Akihiro Hamano
  • Publication number: 20050221537
    Abstract: The present invention provides a high heat dissipation plastic package and a method for making the same that provides an inexpensive, thin high heat dissipation plastic package with good bonding precision and minimal bleeding of adhesive resin. A Cu foil resin film is formed by bonding an adhesive resin to a Cu foil and pre-forming, at an essentially central position, a cut-out for a cavity used to mount a semiconductor element. The Cu foil resin film is bonded using the adhesive resin directly to a heat dissipation plate. A conductor wiring pattern is formed on the Cu foil resin film. Furthermore, the heat dissipation plate includes a stopping section used to prevent resin from bleeding onto a cavity when bonding with the adhesive resin of the Cu foil resin film.
    Type: Application
    Filed: April 14, 2005
    Publication date: October 6, 2005
    Applicant: Sumitomo Metal (SMI) Electronics Devices Inc.
    Inventors: Shigehisa Tomabechi, Akihiro Hamano
  • Publication number: 20050073044
    Abstract: The present invention provides a high heat dissipation plastic package and a method for making the same that provides an inexpensive, thin high heat dissipation plastic package with good bonding precision and minimal bleeding of adhesive resin. A Cu foil resin film is formed by bonding an adhesive resin to a Cu foil and pre-forming, at an essentially central position, a cut-out for a cavity used to mount a semiconductor element. The Cu foil resin film is bonded using the adhesive resin directly to a heat dissipation plate. A conductor wiring pattern is formed on the Cu foil resin film. Furthermore, the heat dissipation plate includes a stopping section used to prevent resin from bleeding onto a cavity when bonding with the adhesive resin of the Cu foil resin film.
    Type: Application
    Filed: December 23, 2003
    Publication date: April 7, 2005
    Applicant: Sumitomo Metal Electronics Devices Inc.
    Inventors: Shigehisa Tomabechi, Akihiro Hamano
  • Patent number: 6871962
    Abstract: A one piece, double gland, quad lobe design gasket system for use in a projection system that redundantly seals in the liquid present in a coupler supporting a projection lens in alignment with a projection optical signal generation device (e.g., a Cathode Ray Tube). The coupler defines a cooling chamber between said projection lens and said projection signal generating device and is filled with liquid in order to transport the optical signal between the projection optical signal generation device and projection lens while minimizing contrast distortion. In order to prevent leaking from the cooling chamber between the coupler and projection signal generation device, an improved sealing system is used by providing two separate channels in the coupler and using the integral double gland, quad lobe gasket. Each gland is placed in a corresponding groove in the coupler thus creating two separate lines of seal that keeps the liquid in the coupler from leaking out.
    Type: Grant
    Filed: September 5, 2003
    Date of Patent: March 29, 2005
    Assignee: Hitachi Electronic Devices, Inc.
    Inventor: Jeffrey Scott Kane
  • Patent number: 6861747
    Abstract: (1) A thermal enhanced type of BGA package, in which a metal heat sink is joined to one side of a plastic circuit board which has a cutout space in the central portion, comprised of a clamping member joining the plastic circuit board and the heat sink. A caulking member, a rivet, a screw, an eyelet, or a tubular rivet could be used as the clamping member. It is preferable that a dam member is definitely attached by the clamping member. (2) Another thermal enhanced type of BGA package, in which a circuit pattern is provided in the plastic circuit board and the heat sink and/or the dam member are electrically connected to a part of the circuit pattern through the clamping member. It is preferable to use the clamping member coated by solder.
    Type: Grant
    Filed: April 8, 2002
    Date of Patent: March 1, 2005
    Assignee: Sumitomo Metal (SMI) Electronics Devices Inc.
    Inventors: Takeshi Miyazaki, Akihiro Hamano, Shigehisa Tomabechi
  • Publication number: 20040258948
    Abstract: A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn—Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a package. The lid can be joined to a base of a package at a low temperature, thereby reducing vaporization of solder components and adhesion thereof to electronic devices within the package.
    Type: Application
    Filed: June 7, 2004
    Publication date: December 23, 2004
    Applicants: Senju Metal Industry Co., Ltd., Sumitomo Metal (SMI) Electronics Devices Inc.
    Inventors: Hideyuki Yoshino, Sanae Taniguchi, Mitsuo Zen, Takenori Azuma
  • Patent number: 6781488
    Abstract: A connected construction of a high-frequency package and a wiring board have an excellent high-frequency transmission characteristic without degradation of the transmission characteristic of even high-frequency signals in a wide band ranging from 20 GHz to 80 GHz in the case of connecting a high-frequency package to a wiring board. A distance between conductive vias and conductive vias to connect grounds formed on both main surfaces of a high-frequency transmission line substrate constituting the high-frequency package, and a distance between conductive vias and conductive vias to connect grounds formed on both main surfaces of the wiring board on which the high-frequency package is mounted, are set in consideration of the dielectric constant of the high-frequency transmission line substrate and the dielectric constant of the wiring board in order to improve the high-frequency transmission characteristic between the high-frequency transmission line substrate and the wiring board.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: August 24, 2004
    Assignee: Sumitomo Metal (SMI) Electronics Devices Inc.
    Inventors: Yoshio Tsukiyama, Masato Shiobara
  • Publication number: 20040040856
    Abstract: The method for making plastic packages of the present invention includes: forming an electroless Cu plating film on a resin substrate after removing a Cu foil; disposing a first plating resist pattern thereupon, passing electricity through the electroless Cu plating film, and disposing an electrolytic Cu plating film where the pattern is absent; disposing a second plating resist pattern to form a circuit pattern, and disposing a Ni and Au plating film; removing the plating resist pattern and etching away the Ni and Au plating film and the electroless Cu plating film not covered by the electrolytic Cu plating film; and disposing a solder resist film with openings to expose an external terminal connection pad and a semiconductor element connection pad. This method provides superior bonding properties with a solder resist, reduces undercutting during etching, allows use of high-density circuits, provides high reliability, and improves yield.
    Type: Application
    Filed: April 23, 2003
    Publication date: March 4, 2004
    Applicant: Sumitomo Metal Electronics Devices Inc.
    Inventor: Akihiro Hamano