Patents Assigned to Electronvault, Inc.
  • Patent number: 8691422
    Abstract: A modular interconnection system in the form of a releasable modular interconnect is provided. The releasable modular interconnect may include a substrate with a plurality of releasable contact regions, where each releasable contact region may be positioned to overlay a respective terminal of a power cell. The releasable modular interconnect may also include at least one conductive interconnect member affixed to the substrate, where the conductive interconnect member includes at least a one conductive releasable contact disposed within a releasable contact region of the substrate. The conductive releasable contact may be positioned to form a releasable electrical connection with a terminal of a power cell when a force is applied to the first releasable contact region in a direction toward the terminal of the power cell. Additional and related methods and apparatuses are also provided.
    Type: Grant
    Filed: November 28, 2012
    Date of Patent: April 8, 2014
    Assignee: Electronvault, Inc.
    Inventor: Robert R. Ferber, Jr.
  • Publication number: 20130089990
    Abstract: A modular interconnection system in the form of a releasable modular interconnect is provided. The releasable modular interconnect may include a substrate with a plurality of releasable contact regions, where each releasable contact region may be positioned to overlay a respective terminal of a power cell. The releasable modular interconnect may also include at least one conductive interconnect member affixed to the substrate, where the conductive interconnect member includes at least a one conductive releasable contact disposed within a releasable contact region of the substrate. The conductive releasable contact may be positioned to form a releasable electrical connection with a terminal of a power cell when a force is applied to the first releasable contact region in a direction toward the terminal of the power cell. Additional and related methods and apparatuses are also provided.
    Type: Application
    Filed: November 28, 2012
    Publication date: April 11, 2013
    Applicant: ELECTRONVAULT, INC.
    Inventor: ELECTRONVAULT, INC.
  • Publication number: 20130062946
    Abstract: An example hierarchical balancing system is described that performs balancing amongst power packs comprising an arrangement of power cells, while the power packs separately perform cell-level balancing. A power pack impedance balancer may be implemented for power pack balancing using changes in impedance. An example apparatus may include a rail capacitor that is switchably connected to a first capacitor and switchably connected to a second capacitor. The first capacitor may also be switchably connected to a first power pack and the second capacitor may also switchably connected to a second power pack. Via controllable switches, the first and second capacitors may shuttle energy between the power packs through the rail capacitor. Additional and related methods and apparatuses are also provided.
    Type: Application
    Filed: September 14, 2011
    Publication date: March 14, 2013
    Applicant: ELECTRONVAULT, INC.
    Inventor: Robert R. Ferber, JR.
  • Patent number: 8361646
    Abstract: A modular interconnection system in the form of a releasable modular interconnect is provided. The releasable modular interconnect may include a substrate with a plurality of releasable contact regions, where each releasable contact region may be positioned to overlay a respective terminal of a power cell. The releasable modular interconnect may also include at least one conductive interconnect member affixed to the substrate, where the conductive interconnect member includes at least a one conductive releasable contact disposed within a releasable contact region of the substrate. The conductive releasable contact may be positioned to form a releasable electrical connection with a terminal of a power cell when a force is applied to the first releasable contact region in a direction toward the terminal of the power cell. Additional and related methods and apparatuses are also provided.
    Type: Grant
    Filed: March 15, 2010
    Date of Patent: January 29, 2013
    Assignee: Electronvault, Inc.
    Inventor: Robert R. Ferber, Jr.