Abstract: A manufacturing system for assembly of component parts to produce an article includes a plurality of separate process modules for executing the various process steps, and a plurality of magazine units, which can be coupled to the process modules, for storage and transport of article components produced in the process steps. The process modules have a substantially identical base structure which can be suited to the respective process steps.

Abstract: A temperature limiter includes a switch head with a switching contact and a temperature sensor having elongate expansion elements of different thermal expansion coefficients. The expansion elements are fixed relative to one another in one end zone and movable relative to one another in the other end zone. Slidably supported in the switch head is a ram which abuts against the movable expansion element and has an end portion constructed to allow application of welding or soldering. A switch sleeve is placed over the ram end portion and adapted to actuate the contact. The switch sleeve is movable relative to the ram during a calibration phase, until reaching a position which is determinative for calibrating a desired response temperature of the switching contact. In this position, the switch sleeve is then securely fixed to the end portion by fusion welding or soldering.

Abstract: A temperature sensor includes a sensor tube and a sensor rod received in the sensor tube and having a thermal expansion coefficient which differs from a thermal expansion coefficient of the sensor tube. The sensor rod has one end, which is supported by a free end of the sensor tube, and another end, which forms an actuating element of a switching contact assembly. An insulating member at least partly surrounds the switching contact assembly and has an opening for passage of the sensor tube with accommodated sensor rod. Mounted to the insulating member in the area of the opening is a support plate which is connected at least indirectly to the sensor tube by a welding process such that an opening-surrounding wall portion of the insulating member is held in place.

Abstract: A process for making a metal-matrix composite (MMC), includes a mixture of particulate ceramic powder with a liquid carrier, without addition of a binder, to prepare a slip having thixotropic properties. The slip is introduced in a substantially dense consistency into a casting mold which is then subjected to vibrations so as to separate the carrier from the ceramic particles and to allow the carrier to float upon the ceramic particles while at the same time compacting the slip to realize a ceramic preform of porous consistency having pores. After terminating the exposure of the casting mold to vibrations, the liquid carrier is removed and the preform is allowed to solidify in the casting mold, without exposure to any further compaction measures, such as sintering, pressing or the like, and the casting mold is maintained in a position of rest. Subsequently, matrix metal is poured into the casting mold to fill the pores of the preform.

Abstract: A temperature limiter includes a switch head with a switching contact and a temperature sensor having elongate expansion elements of different thermal expansion coefficients. The expansion elements are fixed relative to one another in one end zone and movable relative to one another in the other end zone. Slidably supported in the switch head is a ram which abuts against the movable expansion element and has an end portion constructed to allow application of welding or soldering. A switch sleeve is placed over the ram end portion and adapted to actuate the contact. The switch sleeve is movable relative to the ram during a calibration phase, until reaching a position which is determinative for calibrating a desired response temperature of the switching contact. In this position, the switch sleeve is then securely fixed to the end portion by fusion welding or soldering.

Abstract: An AlN substrate is disclosed that can be bonded to a copper foil by a direct-copper-bonding (DCB) method. The bonding surface of the AlN substrate includes at least one auxiliary layer containing at least 50 wt. % CuAlO2 and an excess of Cu2O. Also disclosed is a process for preparing the auxiliary layer by applying a material containing copper, copper oxide and/or other copper-containing compounds, followed by an oxidation and reduction process.

Abstract: The invention relates to a method for attaching a first body which is of one of a metal matrix composite (MMC)-material or copper to a second body which is a ceramic member for acting as a heat sink, wherein the surface of the ceramic member which is placed against the MMC- or copper body is coated with a first metal by heating the two bodies to above the eutectic temperature of a system comprised of the matrix metal of the MMC-body or the copper of the copper body and the first metal applied to the surface of the ceramic member; and subsequently cooling the system to room temperature.

Abstract: A heat sink adapted for use with an electrical and/or electronic device, in particular with a semiconductor chip such as an integrated circuits, or with a casing for such a device, is formed from a material including whiskers.

Abstract: Metal matrix composite body (MMC body) includes a porous reinforcement material (15) having pores being filled with an infiltration material (14) selected from the group metal and metal alloy, with the reinforcement material (15) being formed by recrystallized silicon carbide (RSiC).

Abstract: Apparatus for limiting the temperature of a cooking location of a type having an electrically conductive burner housing forming a heating chamber, includes a temperature sensor including an outer tube and an inner rod received within the tube, a switch base carrying at least one contact which is actuated by the temperature sensor, an electrode at least partially positioned in the heating chamber and secured to at least one element selected from the group consisting of temperature sensor and switch base, and a current measuring device having a first terminal connected to the electrode and a second terminal connected to the burner housing.

Abstract: A molded article of metal matrix composite (MMC) includes a preform infilted in a casting process with metal or metal alloy, with the preform comprised of a plurality of spaced preform plates arranged in mosaic disposition in at least one plane, or stacked in several planes above one another, and formed with bores. The spacing between neighboring preform plates and the spacing between overlying planes of preform plates are filled with infiltration metal or metal alloy, without permeation of infiltration metal into the bores.

Abstract: Apparatus for controlling the temperature of a cooking location of a cooking unit includes a temperature sensor having an outer tube and an inner rod received within the tube and having a different coefficient of expansion, a switch base operatively connected to the temperature sensor and carrying electric contacts actuated by the temperature sensor, and an igniter connected to the temperature sensor and/or switch base.

Abstract: A method of depositing a polycrystalline diamond layer on a nitride substrate is disclosed, which comprises chemically-etching the nitride substrate with a KOH or NaOH solution or melt and depositing the polycrystalline diamond layer on the nitride substrate from a vapor phase, wherein the etching temperature, time and concentration of the etchant are controlled so that at least 75% of the interface between the substrate and the diamond layer is covered by diamond crystals, each diamond crystal having a contact area with the substrate of .gtoreq.20 um.sup.2.

Abstract: Method of making MMC components by an infiltration process, with a preform (3) which is disposed inside a crucible (6) and, optionally, held by a preform holder (2), being placed inside a pressure container (1), wherein the atmosphere inside the pressure container (1) is changeable during the production process, and after the infiltration metal (4) has melted on, the preform (3) is contained inside a sealed atmosphere in the presence of an oxygen-binding material.

Abstract: A process of making a casing having at least one open end and formed with electric conducting passages and connections for electronic components or switching circuits, includes the following steps: preparing a formed body, made of ceramics, glass, glass-ceramics, metal or silicon carbide, with passageways in form of bores and/or indentations, placing the formed body in a mold and pouring liquid metal in the mold to surround the formed body, thereby filling the first passageways, and removing metal from the formed body to leave metal only in the first passageways.

Abstract: A temperature sensor includes a spring-biased tube of relatively low thermal expansion and a rod arranged in the tube and having relatively high thermal expansion for cooperation with a contact mechanism to control a heat-operated system. Secured to the tube on one end thereof which is proximate to the contact mechanism is a substantially hemispherical end piece for placement in a concave receptacle that is arched in direction of the contact mechanism and traversed by the rod.

Abstract: A circuit board includes a substrate of ceramic material and conductive strips in form of a metal layer which is cast onto the surface of the substrate and formed through locally stripping metal layer from the substrate surface. The circuit board further includes a recess for receiving an inlay of metal matrix composite material.

Abstract: A preform of reinforcement material is infiltrated with fusible metal without preceding vacuum treatment of the preform through gas pressure application solely. The infiltrated preform is allowed to solidify under pressure.

Abstract: A compression glass lead-in arrangement in a metal body, especially in metal housings for semiconductors, in particular integrated circuits. The lead-through arrangements hermetically seal the interior of the housing relative to the environment. A glass bead is fused into a bore in the housing and the connecting conductor of the integrated circuit is passed outwardly through the glass. Alloys of the systems Cu, Al and Mg, during a cooling phase after the fusing-in exhibit a hardening effect which provides that in conjunction with the alloys, it is possible to produce compression glass lead-in arrangements which possess a hermetic sealing integrity even after a high degree of thermal and/or mechanical loading, have a high resistance to fluctuations in temperature and good resistance to corrosion.

Abstract: A method of making a gastight connection between a conductor and an insulation in form of a tube made of a temperature-resistant material, includes the steps of inserting a conductor-forming wire of metal in the tube and heating the wire within the tube to a temperature above its melting point, whereby the tube essentially maintains its configuration.