Abstract: A thermal conditioning device (100) is proposed, wherein a process heat-conductive fluid (110) is caused to circulate in a plurality of extensible elements (105); a pressure of the process heat-conductive fluid (110) is regulated to lengthen the extensible elements (105) so that they are pressed against corresponding electronic devices under test (205) for conditioning them thermally. A test apparatus (200) comprising this thermal conditioning device (100) is also proposed. Moreover, a corresponding method for condition electronic devices under test (105) thermally and a corresponding method for testing electronic devices (205) are proposed.

Abstract: A thermal conditioning device (100) is proposed, wherein a process heat-conductive fluid (110) is caused to circulate in a plurality of extensible elements (105); a pressure of the process heat-conductive fluid (110) is regulated to lengthen the extensible elements (105) so that they are pressed against corresponding electronic devices under test (205) for conditioning them thermally. A test apparatus (200) comprising this thermal conditioning device (100) is also proposed. Moreover, a corresponding method for condition electronic devices under test (105) thermally and a corresponding method for testing electronic devices (205) are proposed.

Abstract: A solution for testing a set of one or more electronic device (105) is disclosed. A corresponding test board (100) comprises a support substrate (205), a set of one of more sockets (210) being mounted on the support substrate each one for housing an electronic device (105) to be tested with a main surface thereof facing the support substrate, for each socket a thermal conditioning element (235) for acting on the main surface of the electronic device, and for each socket biasing means (240) being switchable between an active condition, wherein the biasing means biases the thermal conditioning element in contact with the main surface of the electronic device, and a passive condition, wherein the biasing means maintains the thermal conditioning element separate from the main surface of the electronic device.

Abstract: An embodiment test system is proposed; the test system is used to test electronic devices each one having a case with a plurality of terminals for example, of the BGA type. The test system includes a set of (one or more) test boards. Each test board includes a plurality of banks of electrically conductive receptacles, each one for resting a corresponding electronic device; each receptacle is adapted to receive a terminal of the corresponding electronic device. A set of (one or more) boxes is arranged in operation above the test boards. Each box defines an expandable chamber for a conditioning fluid; particularly, the box includes a rigid body, a flexible membrane of a thermally conductive material facing the test boards, an inlet, and an outlet. Means is provided for controlling a temperature of the conditioning fluid (for example, a heat exchanger).

Abstract: An embodiment of a cartridge is proposed for testing integrated circuits on a wafer with the wafer that has a wafer front surface with a plurality of terminals of the integrated circuits. The cartridge includes a probe card, which has a card front surface with a plurality of probes for contacting the terminals of the integrated circuits electrically, and a card back surface opposite the card front surface. Locking means is provided for locking the wafer on the probe card. The locking means includes one or more through-holes that cross the probe card from the card front surface to the card back surface; sealing means is arranged on the card front surface around the probes and the through-holes. In this way, a substantially airtight chamber is defined by the probe card, the sealing means and the wafer when the wafer front surface abuts against the sealing means. Coupling means is arranged on the card back surface.

Abstract: An embodiment is proposed for testing electronic devices; each electronic device has a plurality of terminals for electrically contacting the electronic device. A corresponding test system includes a set of test boards; each test board is equipped with a plurality of banks of electrically conductive receptacles each one for resting a corresponding electronic device (with each receptacle that is adapted to receive a terminal of the corresponding electronic device). Locking means are provided for mechanically locking the electronic devices on the test boards. The locking means include free means—such as ferromagnetic discs—being adapted to be freely rested on the electronic devices for pressing the electronic devices against the test boards—for example, because of the attractive force exerted by corresponding magnetic discs being fastened under the test board.

Abstract: An embodiment of a cartridge is proposed for testing integrated circuits on a wafer with the wafer that has a wafer front surface with a plurality of terminals of the integrated circuits. The cartridge includes a probe card, which has a card front surface with a plurality of probes for contacting the terminals of the integrated circuits electrically, and a card back surface opposite the card front surface. Locking means is provided for locking the wafer on the probe card. The locking means includes one or more through-holes that cross the probe card from the card front surface to the card back surface; sealing means is arranged on the card front surface around the probes and the through-holes. In this way, a substantially airtight chamber is defined by the probe card, the sealing means and the wafer when the wafer front surface abuts against the sealing means. Coupling means is arranged on the card back surface.

Abstract: An embodiment test system is proposed; the test system is used to test electronic devices each one having a case with a plurality of terminals for example, of the BGA type. The test system includes a set of (one or more) test boards. Each test board includes a plurality of banks of electrically conductive receptacles, each one for resting a corresponding electronic device; each receptacle is adapted to receive a terminal of the corresponding electronic device. A set of (one or more) boxes is arranged in operation above the test boards. Each box defines an expandable chamber for a conditioning fluid; particularly, the box includes a rigid body, a flexible membrane of a thermally conductive material facing the test boards, an inlet, and an outlet. Means is provided for controlling a temperature of the conditioning fluid (for example, a heat exchanger).

Abstract: An embodiment of a process of manufacturing an interconnection element for contacting electronic devices is proposed. The process starts with the step of forming a plurality of leads on a main surface of a first substrate; each lead has a first end and a second end. The second end of each lead is coupled with a second substrate. The second substrate and the first substrate are then spaced apart, so as to extend the leads between the first substrate and the second substrate. The process also includes the step of treating the main surface before forming the leads to control an adhesion of the leads on the main surface.