Abstract: A circuit board and a manufacturing method thereof are provided. The manufacturing method includes the following steps. A substrate having a first surface and a second surface opposite to each other is provided. A first circuit layer is formed on the first surface. A stress is applied to the first circuit layer and the substrate using a awl tool, such that the first circuit layer and the substrate are deformed to form a through hole. A portion of the first circuit layer is located on the sidewalls of the through hole and an end of the through hole is protruded from the second surface. A printing process is performed to form a second circuit layer on the second surface. The second circuit layer is connected to the first circuit layer located in the through hole.

Abstract: A keyboard device including a bottom plate, a keyboard film and button structures is provided. The keyboard film is disposed on the bottom plate and has a first electrode film, an insulating layer, and a second electrode film. The first electrode film has keypad circuits. The second electrode film is disposed opposite to the first electrode film and has light sources. The insulating layer is disposed between the first electrode film and the second electrode film. The button structures are disposed on the keyboard film.

Abstract: A keyboard device including a frame made of two materials, a keypad film, and multiple button assemblies is provided. The frame made of two materials includes a bottom plate and multiple fixing structures, wherein the fixing structures are integrally formed at the bottom plate by in-mold injection. The keypad film is disposed on the frame made of two materials, and the button assemblies are disposed on the keypad film and assembled to the fixing structures.