Abstract: Disclosed is an integrated interfacing system for intelligent defect yield solutions. The integrated interfacing system is configured to have a web server, which initiates a web interface for containing a plurality of functional items provided for clicking to activate a corresponding function. Through the graphical user interface, users may select one or more functions for viewing the multiple solutions regarding wafer yield. The system uses a memory to store the computer-executable instructions for selectively performing corresponding functionalities. When the wafer images are inputted through the interface, the system performs a defect coordinate conversion, dashboard summary, defect screening, defect sampling, defect yield diagnosis, design for yield, yield prediction, pattern diagnosis, data management, and system administration. By the interfacing system, an additional viewing method is also introduced to provision of full-chip viewing over the data retrieved during the wafer manufacturing procedure.

Abstract: An intelligent defect diagnosis method for manufacturing fab is provided. The intelligent defect diagnosis method comprises: receiving pluralities of defect data, design layouts and fabrication data; analyzing the defect data, design layouts, and the fabrication data by a defect analysis system, wherein the analyzing step further contains the sub-steps: segmenting and grouping the design layouts into pluralities of multi-pattern group cells to construct LPG cell based pattern groups; introducing the defect data; segmenting defect image into pluralities of defect and pattern contours; mapping the defect data to each multi-pattern group cell to form the LPG based defect composite pattern group; performing coordinate conversion and pattern match between image contour and design layout for coordinate correction; fulfilling CAA with defect contour, pattern contour and design layout, and obtaining corresponding defect yield; classifying the defect type of defect data through defect image classification analysis.

Abstract: A method for smart defect review is disclosed. The method includes pre-processing a design layout into a plurality of layout based pattern groups, dividing the design layout into a plurality of cells, overlapping the cells belong to the same layout based pattern groups, extracting a plurality of defect data of all defects on a wafer, constructing a plurality of layout based defect composite pattern groups, executing layout pattern match to obtain each individual layout based defect composite pattern group, performing some defect sample selection rules to each layout based defect composite pattern group, sorting the layout based defect composite pattern groups into different defect types, obtaining a defect image file by reviewing different sample number of defect image from each layout based defect composite pattern group, and generating a defect pattern library or a defect yield prediction by performing a defect yield diagnosis to the defect image file.