Abstract: An integrated apparatus and method to provide test, diagnostics and characterization access to backplane electrical signals during electronic product development is presented. The apparatus removes need for manual and ad hoc connections made in an engineering laboratory or assembly line which make the process prone to damage of the components, inaccurate measurements and arbitrary fluctuations in function. The method and apparatus is a mechanized way to connect backplane signals to corresponding drivers, receivers and test equipment through probes placed on equidistant electrical traces, reducing inter signal variations.

Abstract: An enclosure for housing electronic circuit boards, which enclosure includes a fan tray assembly which may be easily removed from and inserted into the enclosure.

Abstract: A system for dissipating static electric charge from electronics on a circuit board as the board is inserted into the enclosure, the system comprising one or more elastic, deformable and electrically conductive gaskets mounted within the enclosure for engaging ground pins on the circuit board.