Abstract: A sensor element having a sensitive sensor portion on an upper side of a substrate layer. The upper side of the substrate layer is provided with a recess on the periphery of the sensitive sensor portion. The recess provides mechanical isolation or decoupling of the sensitive sensor portion, as a result of which external forces do not cause stress in the sensitive sensor portion. In addition, a sensor assembly is described which is provided with at least one sensor element and a casing.

Abstract: Package (1) having a sensor assembly (2) with at least one sensitive surface (21) and an attachment surface (22), a carrier element (3) with a sensor attachment area (31), and a sensor attach material (4) for attaching the sensor assembly (2) to the sensor attachment area (31) of the carrier element. The package (1) comprises an encapsulation (5) of a first material, in which the encapsulation (5) covers the sensor attachment area (31) of the carrier element (3) and the sensor attach material (4) and leaves the at least one sensitive surface (21) free from the first material.

Abstract: Package for an integrated circuit (IC), includes a housing (3) of a first material having two major surfaces (4, 5). The major surfaces are substantially parallel to each other. Furthermore, a lead frame (6) is present for carrying the IC (2), the lead frame (6) including contact terminals (7) for electrical communication with the IC (2). The package (1) has a through-hole (8) in the two major surfaces (4, 5), allowing various special applications of the package (1).

Abstract: A sensor element having a sensitive sensor portion on an upper side of a substrate layer. The upper side of the substrate layer is provided with a recess on the periphery of the sensitive sensor portion. The recess provides mechanical isolation or decoupling of the sensitive sensor portion, as a result of which external forces do not cause stress in the sensitive sensor portion. In addition, a sensor assembly is described which is provided with at least one sensor element and a casing.

Abstract: Method for encapsulating a chip having a sensitive surface exposed in a sealed highly clean cavity package, includes bonding a chip's contact pads to lead frame contact pads, positioning the chip and lead frame into one part of a two part mould, taking measures to keep the space above the sensitive surface of the chip free during the encapsulation process, closing the mould with a second mould part, introducing the package material into the closed mould and providing the circumstances to let the package cure. The method also including applying a closed dam of heat resistant material around the sensitive chip area and placing a lid on the dam such that space above the sensitive area enclosed by the dam and the lid is sealed.

Abstract: Method for encapsulating a chip with encapsulant, one portion of the surface of which chip must remain free of encapsulant, comprising the following steps: fixing the chip on a carrier with a suitable conductor structure, placing carrier and chip in one part of a mould, positioning a material on the mould or the chip surface, such that this material is clamped between the chip and mould after the mould has been closed, closing the mould, introducing the encapsulant and at least partially curing the encapsulant. The material is a heat-resistant moulding, having dimensions in the directions parallel to the surface of the chip such that an accurately delimited portion of the chip surface will be covered when the mould is closed, and a dimension in the direction perpendicular to the chip surface determined by the distance between the mould surface and the free portion of the chip surface.