Abstract: A process for lift-off of at least one thin film layer situated on a substrate is disclosed, including the steps of: depositing a support layer such as polymer on the thin film layer, wherein the support layer maintains the structural integrity of the thin film layer; attaching a rigid carrier superstrate to the support layer; and removing at least a portion of the substrate, wherein the thin film layer remains attached to the carrier superstrate via the support layer. After removing the substrate, the thin film layer is attached to a host substrate, and the carrier superstrate is removed from the thin film layer to leave the thin film layer attached to the host substrate. Removing the carrier superstrate from the thin film layer can include mechanically detaching the carrier superstrate from the thin film layer, such that only selected segments of the thin film layer remain attached to the host substrate.