Abstract: A conduction cooled electronic card module is designed for insertion into a chassis of an electronic device so as to transfer thereto a heat generated by electronic components of the module. The module comprises a circuit card of a convection cooled type, and a thermally conductive frame carrying the circuit card. The circuit card has a front surface carrying at least a part of the electronic components, and a rear surface at least edge areas of which are adapted to be in thermal contact with the chassis. The frame is in thermal contact with the part of the electronic components and with the front surface of the circuit card at least at edge areas thereof, so as to conduct heat generated by the electronic components, via the edge areas of the front surface to the edge areas of the rear surface of the circuit card.

Abstract: A conduction cooled electronic card module is designed for insertion into a chassis of an electronic device so as to transfer thereto a heat generated by electronic components of the module. The module comprises a circuit card of a convection cooled type, and a thermally conductive frame carrying the circuit card. The circuit card has a front surface carrying at least a part of the electronic components, and a rear surface at least edge areas of which are adapted to be in thermal contact with the chassis. The frame is in thermal contact with the part of the electronic components and with the front surface of the circuit card at least at edge areas thereof, so as to conduct heat generated by the electronic components, via the edge areas of the front surface to the edge areas of the rear surface of the circuit card.

Abstract: A conduction cooled electronic card module is designed for insertion into a chassis of an electronic device so as to transfer thereto a heat generated by electronic components of the module. The module comprises a circuit card of a convection cooled type, and a thermally conductive frame carrying the circuit card. The circuit card has a front surface carrying at least a part of the electronic components, and a rear surface at least edge areas of which are adapted to be in thermal contact with the chassis. The frame is in thermal contact with the part of the electronic components and with the front surface of the circuit card at least at edge areas thereof, so as to conduct heat generated by the electronic components, via the edge areas of the front surface to the edge areas of the rear surface of the circuit card.

Abstract: A gyrotron backward wave oscillator device is described which can be operated in a controlled and predictable manner. The device includes an evacuated waveguide section, an electron source at one end providing a spiral electron beam, a collector at the opposite end, means for producing a magnetic field parallel to the longitudinal axis of the waveguide section, and an output window, the parameters of the device being such as to support backward wave oscillation therein and to output same through the window.

Abstract: An electron gun producing a spiral electron beam for gyrotron devices comprises means for producing an axial magnetic field propagating the beam axially beyond the anode of the electron gun, and separate electromagnets for producing a transverse "kicker" electromagnetic field beyond the anode and perpendicular to the magnetic propagation field such as to apply a transverse impulse of short duration, imparting a transverse motion, to the electrons to cause them to spiral as they are propagated axially beyond the anode.