Abstract: A power module comprises a high frequency switching electronic power conditioner including stacked rectifier/filters, the stacked rectifier/filters generating stacked DC output voltages; and a vacuum electronic device coupled to the high frequency switching electronic power conditioner, the vacuum electronic device including components, each component receiving a respective DC output voltage of the stacked DC output voltages.

Abstract: Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.

Abstract: A power module comprises a high frequency switching electronic power conditioner including stacked rectifier/filters, the stacked rectifier/filters generating stacked DC output voltages; and a vacuum electronic device coupled to the high frequency switching electronic power conditioner, the vacuum electronic device including components, each component receiving a respective DC output voltage of the stacked DC output voltages.

Abstract: A method of manufacturing a radio frequency (RF) or electron beam structure, comprises forming each layer of multiple layers to be assembled and bonded together with positional alignment, the forming each layer including forming a first via segment of a first particular shape and dimension in the layer at a first location in the layer, such that when the first via segments of the multiple layers are assembled with positional alignment the multiple first via segments align to form a first via; and inserting a first analogous pin into the first via, the first analogous pin being formed based on the first particular shape and dimension of each of the first via segments, such that inserting the first analogous pin into the first via assists in causing the multiple layers to be assembled with positional alignment.

Abstract: A depressed collector, comprises an insulator body; a plurality of serial electrodes, each serial electrode having a serial electrode receptor portion inside the insulator body and having a serial electrode thermal fin portion passing through and extending outside the insulator body; and a terminal electrode having a terminal electrode receptor portion inside the insulator body and having a terminal electrode thermal fin portion passing through and extending outside the insulator body.

Abstract: A power module comprises a high frequency switching electronic power conditioner including stacked rectifier/filters, the stacked rectifier/filters generating stacked DC output voltages; and a vacuum electronic device coupled to the high frequency switching electronic power conditioner, the vacuum electronic device including components, each component receiving a respective DC output voltage of the stacked DC output voltages.

Abstract: A cathode heater assembly for use in a vacuum electronic device includes a refractive cup having a bottom portion and side walls forming a container; a cathode secured in the container of the refractive cup; and a heater wire coupled to the refractive cup. The cathode heater assembly may be manufactured by providing a refractive cup having a bottom portion and side walls forming a container; inserting a cathode pellet in the container of the refractive cup; impregnating the cathode pellet with electron emissive materials while the cathode pellet is in the container of the refractive cup; and attaching a heater wire to the refractive cup.

Abstract: Vacuum electron devices (VEDs) are produced having a plurality of two-dimensional layers of various materials that are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together using brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, and the like. The manufacturing process enables incorporation of metallic, magnetic, and ceramic materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability. The VEDs so produced include a combination of magnetic and electrostatic lenses for electron beam control.

Abstract: Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.

Abstract: Vacuum electron devices (VEDs) are produced having a plurality of two-dimensional layers of various materials that are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together using brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, and the like. The manufacturing process enables incorporation of metallic, magnetic, and ceramic materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability. The VEDs so produced include a combination of magnetic and electrostatic lenses for electron beam control.

Abstract: An electromagnetic waveguide component includes multiple planar layers and one or more layers are shaped to accommodate incoming electromagnetic waves. Each layer includes two more alignment features, and corresponding pins, the two or more alignment features in each of the layers providing precise stacking registration among the plurality of layers, and the planar layers, when assembled into a stack, are configured to provide a desired radio frequency (RF) response.

Abstract: Vacuum electron devices (VEDs) are produced having a plurality of two-dimensional layers of various materials that are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together using brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, and the like. The manufacturing process enables incorporation of metallic, magnetic, and ceramic materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability. The VEDs so produced include a combination of magnetic and electrostatic lenses for electron beam control.

Abstract: Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.

Abstract: Vacuum electron devices (VEDs) are produced having a plurality of two-dimensional layers of various materials that are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together using brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, and the like. The manufacturing process enables incorporation of metallic, magnetic, and ceramic materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability. The VEDs so produced include a combination of magnetic and electrostatic lenses for electron beam control.

Abstract: Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.

Abstract: A handheld, hand-operated blender may include a container, a lid threadably connected to an upper portion of the container, a bottom portion including a stationary bottom portion threadably connected to a lower portion of the container and a rotatable bottom portion rotatable with respect to the container. The blender may also include a blade assembly including a plurality of blades and a shaft rotatably connected to the rotatable bottom portion and a gear assembly mechanically connected to the blade assembly and the rotatable bottom portion such that rotation of the rotatable bottom portion rotates the blade assembly at a faster revolution per minute than the rotation of the rotatable bottom portion.

Abstract: A handheld, hand-operated blender may include a container, a lid threadably connected to an upper portion of the container, a bottom portion including a stationary bottom portion threadably connected to a lower portion of the container and a rotatable bottom portion rotatable with respect to the container. The blender may also include a blade assembly including a plurality of blades and a shaft rotatably connected to the rotatable bottom portion and a gear assembly mechanically connected to the blade assembly and the rotatable bottom portion such that rotation of the rotatable bottom portion rotates the blade assembly at a faster revolution per minute than the rotation of the rotatable bottom portion.