Abstract: The invention relates to an electronic circuit (1) comprising a plurality of printed circuits (2) connected by at least one bus bar (4), each printed circuit (2) comprising at least two superposed layers enclosing at least a portion of said at least one bus bar (4), so as to cover said at least one bus bar (4).
Abstract: The invention relates to an electronic circuit (1) comprising a plurality of printed circuits (2) connected by at least one bus bar (4), each printed circuit (2) comprising at least two superposed layers enclosing at least a portion of said at least one bus bar (4), so as to cover said at least one bus bar (4).
Abstract: An electric circuit for a power converter having a substrate having a first face on which electronic components are mounted and a second face intended to cooperate with a cooling system, the substrate having a stack of conductive layers made of electrically and thermally conductive material and at least one insulating layer made of electrically insulating material, two successive conductive layers being separated by an insulating layer, and the conductive and insulating layers extending in parallel planes and being mechanically associated together. Each conductive layer has two opposite faces parallel to the plane in which the first face of the substrate extends and includes, on at least one of its two faces, at least one boss extending in a direction perpendicular to the plane, the at least one boss passing through at least one other conductive layer and opening out onto the first or the second face of the substrate.
Abstract: An electric circuit for a power converter having a substrate having a first face on which electronic components are mounted and a second face intended to cooperate with a cooling system, the substrate having a stack of conductive layers made of electrically and thermally conductive material and at least one insulating layer made of electrically insulating material, two successive conductive layers being separated by an insulating layer, and the conductive and insulating layers extending in parallel planes and being mechanically associated together. Each conductive layer has two opposite faces parallel to the plane in which the first face of the substrate extends and includes, on at least one of its two faces, at least one boss extending in a direction perpendicular to the plane, the at least one boss passing through at least one other conductive layer and opening out onto the first or the second face of the substrate.