Patents Assigned to eM-TECH
  • Patent number: 10419847
    Abstract: The present invention discloses a microspeaker enclosure with porous materials, including a microspeaker, an enclosure with the microspeaker therein, the enclosure defining a resonance space and having an upper casing and a lower casing, porous materials filled in the resonance space of the enclosure, and an anti-noise structure which prevents at least one of a collision between the porous materials, a collision between the porous materials and the enclosure, a collision between the porous materials and the microspeaker, and introduction of the porous materials into the microspeaker.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: September 17, 2019
    Assignee: EM-TECH. Co., Ltd.
    Inventors: Kyu Dong Choi, Jong Heon Ha, Hyeon Taek Oh
  • Patent number: 10419848
    Abstract: The present invention discloses a microspeaker enclosure with porous materials, including a microspeaker, an enclosure with the microspeaker therein, the enclosure defining a resonance space and having an upper casing and a lower casing, a sound absorber arranged in the resonance space and defining a space, and porous materials filled in the space defined by the sound absorber.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: September 17, 2019
    Assignee: EM-TECH. Co., Ltd.
    Inventors: Kyu Dong Choi, Seul Ki Nam, Heung Woo Jeong
  • Patent number: 10334342
    Abstract: The present invention relates to a neckband-type wireless sound transducer, and more particularly, to a neckband-type wireless sound transducer that prevents sound from being transferred to the surroundings of the wearer. The neckband-type wireless sound transducer according to the present invention, includes: a main body part configured to be seated on a human body; a main speaker part mounted on the main body part and configured to emit sound to the inside of the main body part; an auxiliary speaker part mounted on the main body part and configured to emit sound for leakage reduction to offset the sound emitted by the main speaker part and leaked to the outside of the main body part; and a controller configured to apply an electric signal for sound emission to the main speaker part and an electric signal for leakage reduction to the auxiliary speaker part.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: June 25, 2019
    Assignee: EM-TECH. Co., Ltd.
    Inventors: Choong Sheek Hong, Joong Hak Kwon
  • Patent number: 10298105
    Abstract: A linear vibrator includes a bracket having a plate shape, a casing having a hexahedral shape with an open bottom and coupled to the bracket, a circuit board on the bracket, a coil on the circuit board, a pair of magnets spaced apart from each other and disposed over the coil at an interval from the coil, a plate having a pair of magnet attachment surfaces attached to top surfaces of the pair of magnets and a connection surface downwardly bent with a step difference from the magnet attachment surfaces and connecting the pair of magnet attachment surfaces, a weight on top of the plate, and a spring on top of the connection surface and formed in a strip shape with two ends secured to the casing and a center portion secured to the connection surface. The spring is bilateral symmetric and has at least a pair of inwardly-bent portions.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: May 21, 2019
    Assignee: EM-TECH, Co., Ltd.
    Inventors: Jong Dae Kim, Keun Yong Hwang
  • Patent number: 10251000
    Abstract: A hearing assistance device for informing about the state of a wearer includes: an input part configured to receive a selection input for either an ambient listening function or a music listening function; at least one microphone configured to pick up ambient sound; a speaker configured to send the ambient sound to the wearer; a communication part configured to perform wired or wireless communication with an external electronic communication device; an indication part configured to indicate that the ambient listening function or the music listening function is being performed; and a controller configured to perform the ambient listening function to pick up ambient sound from the microphone according to a selection input from the input part and send the ambient sound to the speaker, or perform the music listening function to play stored music or music received from the communication part and send the music to the speaker.
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: April 2, 2019
    Assignee: EM-TECH. Co., Ltd.
    Inventors: Choong Sheek Hong, Dong Sung Kim, Yong Jun Kwon, Taek Jin Han
  • Patent number: 10057678
    Abstract: The present invention aims to provide a microspeaker with enhanced low frequency characteristics, by arranging an adsorbent for adsorbing the air in a resonance space and defining a virtual back volume by the air adsorption of the adsorbent. According to an aspect of the present invention, there is provided a microspeaker enclosure with an air adsorbent, including a microspeaker, an enclosure with the microspeaker provided therein, the enclosure defining a resonance space, and an air adsorbent applied to the resonance space of the enclosure, wherein an air adsorption mole ratio per unit volume of the air adsorbent based on a change in the unit pressure is 40.6 mol/m3·atm.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: August 21, 2018
    Assignee: EM-TECH. Co., Ltd.
    Inventors: Joong Hak Kwon, Ghi Yuun Kang, Hwan Ock Choe
  • Patent number: 9900703
    Abstract: The present invention relates to a suspension structure for a high power micro speaker and, more particularly, to a shape of a suspension which ensures a lightweight of the suspension as well as high reliability and a conductive pattern which applies electric signals. The present invention provides a suspension for a high power micro speaker that includes an outer peripheral portion, a central portion and a connection portion, is provided with a conductive pattern, and is formed in a rectangular shape, wherein land portions for use in soldering or welding lead-in wires of a voice coil are formed on long connection portions disposed on long sides.
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: February 20, 2018
    Assignee: EM-TECH. Co., Ltd.
    Inventors: Cheon Myeong Kim, Kyu Dong Choi, In Ho Jeong
  • Patent number: 9832557
    Abstract: A microspeaker includes a frame, magnetic circuit, voice coil configured to generate vibration by mutual electromagnetic force with the magnetic circuit, vibration plate configured to vibrate together according to the vibration of the voice coil to generate a sound, and suspension configured to guide a vibration direction of the vibration plate and voice coil. The suspension has a central portion attached to the voice coil, an annular outer circumferential portion formed to be spaced apart from the central portion by a predetermined interval, and a connection portion connecting the central and outer circumferential portions and configured to perform a damping function. The central portion has an outer end having the same height as the connection and outer circumferential portions, an inner end positioned to be higher than the outer end, and a step portion connecting the outer end and inner end. The voice coil is attached to the inner end.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: November 28, 2017
    Assignee: EM-TECH. Co., Ltd.
    Inventors: Kil Dong Park, Seul Ki Nam, Ji Hoon Kim, Min Chang Kim
  • Patent number: 9693145
    Abstract: The present invention relates to a suspension structure for a high power micro speaker and, more particularly, to a shape of a suspension which ensures a lightweight of the suspension as well as high reliability and a conductive pattern which applies electric signals. The present invention provides a suspension for a high power micro speaker that includes an outer peripheral portion, a central portion and a connection portion, is provided with a conductive pattern, and is formed in a rectangular shape, wherein land portions for use in soldering or welding lead-in wires of a voice coil are formed on long connection portions disposed on long sides.
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: June 27, 2017
    Assignee: EM-TECH. Co., Ltd.
    Inventors: Cheon Myeong Kim, Kyu Dong Choi, In Ho Jeong
  • Patent number: 9473837
    Abstract: The present invention discloses a sound transducer with a ventilation structure capable of securing a flow path of air introduced from within and outside of the sound transducer to the maximum. The sound transducer with a ventilation structure includes a frame, a magnetic circuit installed within the frame, a voice coil vibrating according to mutual electromagnetic force with the magnetic circuit upon receiving an electrical signal, a vibration plate vibrating according to vibrations of the voice coil to generate a sound, and a drain hole formed to be adjacent to the corner of the frame and allowing air to flow between the interior and exterior of the frame.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: October 18, 2016
    Assignee: Em-Tech. Co., Ltd.
    Inventors: Kyu Dong Choi, Kil Dong Park, Ji Hoon Kim, Joong Hak Kwon
  • Patent number: 9277305
    Abstract: An object of the present invention is to provide a suspension for a sound transducer which has a central portion serving as a center diaphragm and which has a cover layer and a copper pattern partially removed to prevent a decrease in sound pressure from being caused by an increase in weight of a vibration system. According to the present invention, there is provided a suspension for a sound transducer which includes a central portion, a peripheral portion, and a support portion for connecting the central portion to the peripheral portion, the suspension comprising: a base film, a conductive film attached on the base film by means of an adhesive, and a cover layer attached on the conductive film by an adhesive, wherein at least part of the cover layer disposed on the central portion is removed.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: March 1, 2016
    Assignee: EM-TECH. Co., Ltd.
    Inventors: Joong Hak Kwon, Ho Il Jeong, Kyu Dong Choi, In Ho Jeong
  • Patent number: 9185477
    Abstract: The present invention relates to a suspension for a sound transducer. The present invention discloses a suspension for a sound transducer, to which a diaphragm and voice coil of the sound transducer are attached and which guides the vibrations of the diaphragm and voice coil, comprising: a central portion to which a voice coil is attached; an outer peripheral portion resting on a frame; and a connecting portion connecting the central portion and the outer peripheral portion, wherein the central portion has a mold portion, which is molded by heat or pressure to take the place of a center diaphragm.
    Type: Grant
    Filed: September 19, 2013
    Date of Patent: November 10, 2015
    Assignee: EM-TECH Co., Ltd.
    Inventors: Ji Hoon Kim, Joong Hak Kwon, Jung Hyung Lee, Hyeon Taek Oh
  • Patent number: 9185494
    Abstract: An inner magnet type microspeaker including a suspension is provided which can maximize the size of a magnet. The inner magnet type microspeaker includes: a frame; a yoke installed inside of the frame and including a bottom surface and sidewalls bent upward from the bottom surface; a magnet bonded to an inside of the yoke; a voice coil located in a gap portion between the sidewalls of the yoke and the magnet; a diaphragm that vibrates by the voice coil; and a suspension where the voice coil is attached, and which guides vibrations of the diaphragm and the voice coil and includes a ring-shaped inner peripheral portion and an outer peripheral portion that surrounds the inner peripheral portion, spaced a predetermined distance apart from the inner peripheral portion, with one end and the other end being connected to the inner peripheral portion.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: November 10, 2015
    Assignee: EM-TECH Co., Ltd.
    Inventors: Kyu Dong Choi, Jong Soo Yoon
  • Publication number: 20150211152
    Abstract: Continuous ceramic (e.g., silicon carbide) nanofibers (502, 602, 604, 606, 608, 702, 704, 1102, 1104) which are optionally p or n type doped are manufactured by electrospinning a polymeric ceramic precursor to produce fine strands of polymeric ceramic precursor which are then pyrolized. The ceramic nanofibers may be used in a variety of applications not limited to reinforced composite materials (400), thermoelectric generators (600, 700) and high temperature particulate filters (1200).
    Type: Application
    Filed: October 5, 2014
    Publication date: July 30, 2015
    Applicant: eM-TECH, Inc.
    Inventor: Pawel Czubarow
  • Patent number: 9088840
    Abstract: The present invention relates to a vibration module for a sound transducer and, more particularly, to a vibration module for a sound transducer which can prevent sound leakage by minimizing contacts between a diaphragm and a voice coil. The vibration module for the sound transducer according to the present invention comprises: a substrate having an inner portion and an outer portion, an electrical connection portion for applying electrical signals to a voice coil being provided on the inner portion and a terminal being provided on the outer portion, for performing electrical connection between the electrical connection portion and the terminal; a first diaphragm attached between the inner portion and outer portion of the substrate; and the voice coil mounted on the inside of the inner portion of the substrate with a certain distance from the first diaphragm and electrically connected to the electrical connection portion.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: July 21, 2015
    Assignee: EM-TECH. Co., Ltd.
    Inventors: Kyu Dong Choi, Kil Dong Park, In Ho Jeong, Joong Hak Kwon
  • Patent number: 9027700
    Abstract: The present invention relates to an assembly structure of a diaphragm for a microspeaker. The present invention discloses a bonding structure of a diaphragm for a microspeaker, the boding structure comprising: a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are attached to the central portion and outer peripheral portion of the suspension, respectively, and a dome portion, which projects between the inner peripheral portion and the outer peripheral portion, wherein the suspension and the side diaphragm are attached by thermal compression.
    Type: Grant
    Filed: September 19, 2013
    Date of Patent: May 12, 2015
    Assignee: Em-Tech. Co., Ltd.
    Inventors: Ji Hoon Kim, Joong Hak Kwon, Jung Hyung Lee, Hyeon Taek Oh
  • Patent number: 9025808
    Abstract: The present invention relates to a high-output microspeaker, and more particularly, to a high-output microspeaker which includes a damper for preventing lateral vibrations of a diaphragm.
    Type: Grant
    Filed: May 10, 2012
    Date of Patent: May 5, 2015
    Assignee: Em-Tech. Co., Ltd.
    Inventors: Joong Hak Kwon, Cheon Myeong Kim, Ji Hoon Kim, Kyu Dong Choi
  • Patent number: 8987951
    Abstract: Disclosed is a linear vibrator, the linear vibrator including a stator having first and second coil blocks coupled to a bottom plate of a casing, a vibrator having a magnet disposed at a position corresponding to the first and second coil blocks, and an elastic member elastically supporting the magnet.
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: March 24, 2015
    Assignee: EM-Tech Co., Ltd
    Inventor: Youngil Park
  • Publication number: 20140321691
    Abstract: The present invention relates to a suspension for a sound transducer. The present invention discloses a suspension for a sound transducer, to which a diaphragm and voice coil of the sound transducer are attached and which guides the vibrations of the diaphragm and voice coil, comprising: a central portion to which a voice coil is attached; an outer peripheral portion resting on a frame; and a connecting portion connecting the central portion and the outer peripheral portion, wherein the central portion has a mold portion, which is molded by heat or pressure to take the place of a center diaphragm.
    Type: Application
    Filed: September 19, 2013
    Publication date: October 30, 2014
    Applicant: Em-Tech. Co., Ltd.
    Inventors: Ji Hoon Kim, Joong Hak Kwon, Jung Hyung Lee, Hyeon Taek Oh
  • Publication number: 20140318885
    Abstract: The present invention relates to an assembly structure of a diaphragm for a microspeaker. The present invention discloses a bonding structure of a diaphragm for a microspeaker, the boding structure comprising: a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are attached to the central portion and outer peripheral portion of the suspension, respectively, and a dome portion, which projects between the inner peripheral portion and the outer peripheral portion, wherein the suspension and the side diaphragm are attached by thermal compression.
    Type: Application
    Filed: September 19, 2013
    Publication date: October 30, 2014
    Applicant: Em-Tech. Co., LTd.
    Inventors: Ji Hoon Kim, Joong Hak Kwon, Jung Hyung Lee, Hyeon Taek Oh