Abstract: Embodiments of the invention are directed to methods of electroplating copper onto at least one surface of a substrate in which more uniform electrical double layers are formed adjacent to the at least one surface being electroplated (i.e., the cathode) and an anode of an electrochemical cell, respectively. In one embodiment, the electroplated copper may be substantially-free of dendrites, exhibit a high-degree of (111) crystallographic texture, and/or be electroplated at a high-deposition rate (e.g., about 6 ?m per minute or more) by electroplating the copper under conditions in which a ratio of a cathode current density at the at least one surface to an anode current density at an anode is at least about 20. In another embodiment, a porous anodic film may be formed on a consumable copper anode using a long conditioning process that promotes forming a more uniform electrical double layer adjacent to the anode.

Abstract: Embodiments of the invention relate to methods of fabricating solar-cell structures and resulting solar-cell structures. In one embodiment of a method of fabricating a solar-cell structure, a substrate including a front surface and an opposing back surface is provided. A porous-silicon layer may be electrochemically formed from a portion of the substrate that extends inwardly from the front surface. A portion of the porous-silicon layer may be electrochemically passivated. Metallic material may be plated to form at least a portion of each of a plurality of electrical contacts that are in electrical contact with the substrate. In a method according to another embodiment of the invention, the porous-silicon layer may used to getter impurities present in the substrate. In such an embodiment, the porous-silicon layer may be removed after gettering.

Abstract: In one embodiment, a substrate holder comprises a base supporting a substrate that includes a surface having a peripheral region. A cover may be assembled with the base and includes at least one opening exposing only a portion of the surface therethrough. A seal assembly substantially seals a region between the cover and base and further adjacent to the peripheral region of the substrate. An electrode includes at least one contact portion positioned within the region and extending over at least a portion of the peripheral region of the substrate. A compliant member comprises a polymeric material and may be positioned within the region between the at least one contact portion and either the peripheral region of the substrate or the cover. In other embodiments, an electroplating system is disclosed that may employ such a substrate holder.