Abstract: A mounting bracket for securing a mezzanine card in a stacked single board computer includes a main body that includes a first end, an opposite second end, a first side surface, and an opposite second side surface. The main body is sized to be positioned along a side surface of the mezzanine card, wherein the first side surface or the second side surface contacts the side surface of the mezzanine card to facilitate securing the side surface of the mezzanine card with respect to a top PCB. The mounting bracket also includes a first arm formed at the first end of the main body, a second arm formed at the second end of the main body, and at least one top rail coupled to the main body, wherein the top rail is configured to secure a top surface of the mezzanine card with respect to a top PCB.

Abstract: A method is provided for assembling a computer that includes a carrier board having a board management controller (BMC), a power supply, and a carrier bus. The method includes coupling a module to the carrier board, determining, by the carrier board, a type of the module, and providing power to the module based on the module type such that a voltage component of the power is one of a first voltage and a second voltage that is different than the first voltage.

Abstract: A wedge lock for use with a single board computer includes a cooling plate positioned with respect to a printed circuit board (PCB), a clamp device configured to secure the single board computer in an operating environment, and a heat conductance plate positioned along a top surface of the cooling plate and a top surface of the clamp device to facilitate conduction cooling of the PCB.

Abstract: A method and apparatus is presented for using multiple device specific interface protocols for communicating with a platform, where each of the devices comprises a set of parameters. For each parameter of each set of parameters a function call is established to set the parameter for each of the devices that enable the parameter. Using each function call, the plurality of object specific interface protocols is then transformed into a non-device specific interface protocol for communication with the platform.

Abstract: A method for converting a computer rear transition input/output (I/O) to front panel I/O is described. The method includes providing a main board having a first main connector having a first set of pins, and affixing a second main connector having a second set of pins to the main board, where a direction of lengths of the first set of pins is other than parallel to a direction of lengths of the second set of pins.

Abstract: A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.

Abstract: A method and apparatus is presented for using multiple device specific interface protocols for communicating with a platform, where each of the devices comprises a set of parameters. For each parameter of each set of parameters a function call is established to set the parameter for each of the devices that enable the parameter. Using each function call, the plurality of object specific interface protocols is then transformed into a non-device specific interface protocol for communication with the platform.

Abstract: A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.

Abstract: An aluminum enclosure of an electronic device is used in a corrosion environment. A long-term low impedance ground connection is needed because of security and EMC reasons. While common surface protection for aluminum in corrosion environments as for example polyurethane paint is not conductive, a stainless steel connector is provided which comprises a head portion and a bolt portion. The bolt portion is inserted into a bore of the enclosure or frame. An annular rib provided on the back side of the head portion defines a cutting edge which cuts into the surface of the aluminum enclosure and provides a gas-tight electrical contact. The front surface of the stainless steel head of the electrical connector element provides a metallic surface for connecting ground wires or other conductors.

Abstract: A multi-processor arrangement having an interprocessor communication path between each of every possible pair of processors, in addition to I/O paths to and from the arrangement, having signal processing functions configurably embedded in series with the communication paths and/or the I/O paths. Each processor is provided with a local memory which can be accessed by the local processor as well as by the other processors via the communications paths. This allows for efficient data movement from one processor's local memory to another processor's local memory, such as commonly done during signal processing corner turning operations. The configurable signal processing logic may be configured to host one or more signal processing functions to allow data to be processed prior to its deposit into local memory.